What are the responsibilities and job description for the Substrate Packaging - Process Integration Engineer (II, III, Senior, Lead) position at Thintronics®?
Substrate Packaging - Process Integration Engineer (II, III, Senior, Lead)
About Thintronics®
More Data. Faster.
Global data traffic is growing exponentially, and AI is rapidly increasing the demand for ultra-high-speed, energy-efficient data transmission. Thintronics is at the forefront of this transformation, revolutionizing copper interconnect technology from the molecular level up. We integrate polymer chemistry, materials science, mechanical engineering, and electrical engineering to develop frontier technologies that help enable higher data rates at lower power consumption.
We are a fast-moving startup based in Alameda, CA, building an exceptional team to tackle complex, multidisciplinary challenges spanning materials science, semiconductor packaging architecture, and system-level optimization.
Job Role – Who We Want
We are seeking highly motivated Process Integration Engineers (II, III, Senior, or Lead level depending on experience) to join our team focused on build-up substrate development for advanced packaging. This position will report directly to the CTO and will contribute to building out our internal process integration capabilities, define processes specific to Thintronics, managing customer programs with aggressive timelines, and collaborating with external tool vendors and substrate partners. The ideal candidate knows they what to be in startup environment and actively chooses it over a more structured, hierarchical large company setting.
A Startup like Thintronics is not for everyone. We want a rare mindset: someone who is obsessive about solving problems and thinks working long hours to find solutions is normal. This is not a 9-to-5 role. We are looking for individuals who take pride in their work, enjoy solving complex problems, and are energized by the opportunity to build world-class technology from the ground up. You will be part of a high-performance team shaping the next generation of process integration for Thintronics materials. Exceptional performers will have significant opportunities to grow quickly within the Company.
Responsibilities
Technical Process Integration
- Define, execute, and optimize process flows for integration of Thintronics materials into substrate packaging environments.
- Contribute to the buildout and operation of our internal process integration lab, establishing robust procedures and process documentation.
- Support customer-specific qualification programs, ensuring timely execution and technical excellence.
- Interface with external tool vendors to specify, install, and qualify process equipment.
Program and Partner Management
- Support customer engagements for process integration, helping ensure programs stay on track and exceed expectations.
- Serve as a key technical contact for integration-related customer discussions and troubleshooting.
- Prepare technical documentation including process guidelines, application notes, qualification reports, and customer deliverables.
- Support customer onboarding and ramp-up through training and process support.
General Requirements
- Passion for working in a startup environment where roles are dynamic, impact is direct, and growth opportunities are abundant.
- Strong problem-solving skills with hands-on experience in process integration, failure analysis, and reliability testing.
- Excellent communication skills, both verbal and written, with the ability to interface effectively with customers, partners, and internal teams.
- Ability to manage multiple high-priority programs in parallel with attention to detail and responsiveness.
Minimum Qualifications
- 3 years of experience in micro-fabrication or semiconductor packaging
- Bachelor’s or Master’s degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.
- Proven experience with process integration activities and working with external vendors and customers.
- Solid understanding of additive and semi-additive processes (SAP), lamination, imaging, drilling, plating, and finishing.
- Familiarity with advanced packaging formats such as FCBGA, SIP, RDL, and embedded die.