Materials & Process Integration Engineer (entry-level) - Technical & Associate Level

Build-up Packaging - Process Integration Engineer (Entry Level)

About Thintronics®

More Data. Faster.

Global data traffic is growing exponentially, and AI is rapidly increasing the demand for ultra-high-speed, energy-efficient data transmission. Thintronics is at the forefront of this transformation, revolutionizing copper interconnect technology from the molecular level up. We integrate polymer chemistry, materials science, mechanical engineering, and electrical engineering to develop frontier technologies that help enable higher data rates at lower power consumption.

We are a fast-moving startup based in Alameda, CA, building an exceptional team to tackle complex, multidisciplinary challenges spanning materials science, semiconductor packaging architecture, and system-level optimization.

Job Role – Who We Want

A Startup like Thintronics is not for everyone. We want a rare mindset: someone who is obsessive about solving problems and thinks working long hours to find solutions is normal.

We are seeking a Process Integration Engineer (Technician or Associate level) to join our fast-growing R&D team focused on advanced semiconductor packaging. This is a hands-on, lab-based role where you will support internal process development and help build capabilities that emulate cutting-edge substrate fabrication technologies, such as electroplating, photolithography, plasma cleaning and desmear, lamination, and laser tooling.

This is not a 9-to-5 role. We are looking for individuals who take pride in their work, enjoy solving complex problems, and are energized by the opportunity to build world-class technology from the ground up. You will be part of a high-performance team shaping the next generation of process integration for Thintronics materials. Exceptional performers will have significant opportunities to grow quickly within the Company.

Responsibilities

Laboratory Operations & Technical Execution

• Assist in daily lab operations including sample preparation, equipment maintenance, and safety procedures.
• Perform hands-on experiments across a range of advanced packaging processes, including lithography, etching, lamination, plating, and cleaning.
• Conduct and document standard operating procedures and contribute to new method development.
• Support the development and refinement of Thintronics’ internal process capability to mimic state-of-the-art substrate fabrication lines.

Process Development & Data Collection

• Run experiments and collect data to support the integration of Thintronics materials into build-up packaging flows.
• Collaborate closely with senior engineers to execute experimental plans and deliver reliable, reproducible results.
• Troubleshoot processing issues with attention to detail and a continuous improvement mindset.

Cross-functional Teamwork

• Engage with R&D, materials, and reliability teams to translate research concepts into manufacturable processes.
• Support failure analysis and yield improvement efforts with basic inspection and defect documentation.

General Requirements

• Passion for hands-on work and enthusiasm for advanced materials and manufacturing processes.
• Strong work ethic and commitment to contributing in a high-energy, fast-paced team environment.
• Ability to follow detailed instructions, execute test plans, and maintain high data integrity.
• Desire to grow within the organization and take ownership of increasingly complex responsibilities.

Minimum Qualifications

• B.S. or M.S. in Materials Science, Chemical Engineering, or a related discipline.
• Prior experience in a lab or manufacturing environment (internships, co-ops, or academic research) preferred.
• Basic understanding of microfabrication or additive processes (e.g., lamination, plating, lithography) is a plus.