What are the responsibilities and job description for the Packaging Designer position at Tessolve?
Hi All,
About Tessolve
:Tessolve Semiconductors, a venture of Hero Electronix, is a Design and Test Engineering Service Company providing End to End Solutions from Product Engineering, Software, Hardware, Wireless, Automotive and Embedded Solutions. Tessolve offers a unique combination of pre-silicon and post-silicon expertise to provide an efficient turnkey solution for silicon bring-up, spec to the product. With 2500 employees worldwide, Tessolve provides a one-stop-shop solution with full-fledged hardware and software capabilities, including its advanced silicon and system testing labs. Tessolve offers a Turnkey ASIC Solution, from design to packaged parts. We have a global presence with office locations in the United States, India, Singapore, Malaysia, Germany, United Kingdom, China, UK, Japan, Thailand, Philippines, and Test Labs in India, Singapore, Malaysia, Austin, San Jose. Tessolve offers a highly competitive compensation and benefits along with an electric work environment to scale one’s intellect, skills and growth
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One of our valued Client is looking for the below requirement
IC Packaging Design Engineer
LOC: Chandler, AZ or Hillsboro, OR
Longterm Contract
Skills Required
Bachelor’s or Master’s degree in Electrical /Electronics Engineering
Experience:
Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)
Candidates should have experience in the below domains:
• Physical Design & Layout
• Substrate design and layout
• SI/PI aware design implementation
• Design for performance, manufacturability, yield, and reliability
• Design rule compliance
Share resume : amritanshuman.swain@tessolve.com