What are the responsibilities and job description for the Packaging Designer position at R CUBE CREATIVE CONSULTING INC?
IC Packaging Design Engineer
đź“Ť Locations: Chandler, AZ OR Hillsboro, OR (Onsite)
đź“„ Long-Term Contract | 1 Year
đź‘Ą Openings: 4
We are hiring experienced IC Packaging Design Engineers for a long-term onsite opportunity with a leading semiconductor client. The ideal candidate will have strong experience in substrate/package layout design and hands-on expertise with Siemens Xpedition (XPD) or Cadence Allegro/APD platforms.
Required Qualifications:
• Bachelor’s or Master’s degree in Electrical/Electronics Engineering
• Strong hands-on experience in Siemens (Mentor) Xpedition (XPD)
OR
Cadence Allegro / Advanced Package Designer (APD / SiP)
Required Skills:
• IC Packaging Physical Design & Layout
• Substrate Design and Layout
• SI/PI Aware Design Implementation
• Design for Manufacturability (DFM)
• Design for Yield & Reliability
• Design Rule Compliance (DRC)
• Package/Substrate Routing
• Semiconductor Packaging Design
Preferred Background:
• Semiconductor Packaging Industry
• High-Speed Package Design
• Multi-layer Substrate Design
• Package Signal Integrity / Power Integrity
Interested candidates can share their updated resume along with contact details and work authorization information.