Wafer Backside Processing Technician - Second Shift

Job Summary:

Performs a variety of technical tasks associated with backside wafer processing and assembly operations. This role supports production and engineering priorities in a cleanroom environment, focusing on die preparation, hybridization, wicking, and wire bonding processes.

This is a second shift position from 2:30 pm to 11:00 pm M-F.

Primary Duties & Responsibilities:

Hybridization Support

• Clean and inspect diced die using approved solvents and cleaning methods
• As needed operate hybridization tools and maintain process parameters for yield optimization

Wicking & Underfill

• Perform wicking operations to ensure proper underfill application
• Monitor curing cycles and maintain accurate process logs

Wirebonding

• Prepare substrates, load programs, perform wirebonding
• Inspect bonds for quality and reliability using microscopes and metrology tools

General Responsibilities

• Maintain detailed records of SPC charts, tool usage, and consumables
• Follow ISO Class 6 cleanroom protocols and 6S principles
• Schedule and coordinate WIP for efficient movement between backside processes
• Inspect and disposition nonconforming product

Job Qualifications:

• High School Diploma or equivalent; technical coursework preferred
• 1–2 years of experience in semiconductor assembly or wafer processing
• Familiarity with cleanroom operations and chemical handling
• Ability to read and follow paper and digital travelers
• Strong attention to detail, communication, and teamwork skills

Physical Requirements:

• Ability to stand and walk for extended periods (up to 8–10 hours per shift)
• Frequent bending, stooping, and reaching to handle wafers and assemblies
• Manual dexterity for handling small components and precision tools
• Ability to lift and carry items up to 25 lbs
• Comfortable working in full cleanroom gowning (coveralls, gloves, mask, eye protection)
• Visual acuity for detailed inspection under microscopes

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