Senior Package Design Engineer

As a Lead Package Design Engineer, you will take ownership of package design and layout for our portfolio of connectivity products deployed by the world’s leading cloud service providers and server/networking OEMs. You will be responsible for driving package substrate design from definition to tape-out, including performance optimization, design for manufacturing, and sign-off verification. You will also , guiding best practices in APD, reviewing design work for quality and consistency, and working closely with SI/PI, product engineering, and hardware teams to ensure first-pass success. 

Basic Qualifications

·                    BS/MS in Engineering (Electrical, Mechanical, Materials Science, Physics, or related field).

·        8 years of experience in Cadence APD/SiP with a track record of independently designing and releasing FCBGA/FCCSP packages from concept to tape-out.

·        Proven experience leading package design efforts, reviewing and mentoring other designers, and setting technical directions.

·        Deep understanding of BGA substrate technologies, stackups, design rules, and assembly processes.

·        Familiarity with package reliability, SI/PI, and design sign-off methodologies.

·        Entrepreneurial, open-minded, and hands-on work ethic with the ability to drive multiple priorities in a dynamic environment.

·        Strong collaboration and communication skills to work effectively across functions and influence outcomes.

Required Experience

·                    Expert proficiency in Cadence APD/SiP (this is a must have). Able to design large-body BGAs from concept through tape-out with minimal guidance.

·        Strong knowledge of package BOM integration, layer stackup, padstacks, constraint setup (physical and electrical), SMT component design, and optimization based on SI/PI feedback.

·        Experience running and interpreting DRC/DRV/LVS/DFM checks, generating documentation, and releasing Gerbers/artwork.

·        Ability to conduct feasibility studies such as fan-out, mock-ups, and layer/package size reduction.

·        Understanding of package manufacturing flow, supply chain considerations, reliability, and risk management.

·        Technical leadership in driving new APD design flows, methodologies, and automation (working with vendors or through scripting).