Electronics Packaging Engineer

Responsibilities:

• Collaborate with related stakeholders (internal, external and international) in cross-functional teams to design packaging structure, prepare drawings, plan and manage schedule for complex engineering problems.
• Manage and lead part development to meet targets for cost, mass, performance and schedule with high quality, efficiency, and optimization mindset from project start through start of production.
• Excellent, clear and frequent communication with internal and external stakeholders (management team, project leaders, manufacturing, suppliers, other design department, TMC Japan, etc.).
• Develop design data in 3D and create 2D drawings using Catia V5.
• Use TBP process to break down problems and contribute to obeya meetings with other commodity engineers, WH supplier engineers, and vehicle assembly members.
• Prepare process documentation using Microsoft Word, Excel, and PowerPoint.
• Performing other duties as assigned.
• Some overtime may be required.

Requirements:

• Hybrid work: At least 4 days per week working in office (1 WFH).
• Bachelor of Science Degree in Engineering discipline, Electrical or Mechanical preferred.
• Fundamental understanding of vehicle development process.
• Fundamental understanding of vehicle manufacturing process.
• 5 or more demonstrated years of experience collaborating with suppliers.
• Proficient in CATIA v5 for parametric 3D data and drawing preparation. (4 yrs)
• 5 or more years of vehicle development experience.
• 4 yrs demonstrated abilities in planning/scheduling, multi-tasking and engaging with multiple stakeholders.
• Experience supporting a production vehicle trial.
• Excellent communication and interpersonal skills.
• Documented problem-solving experience [solve problems and communicate].
• Experience leveraging AI to improve efficiency.

ADDED BONUS

• Experience with in all stages of Vehicle development (Full Model change or Major-Minor model change)
• Proficient in leading variable workforce and/or Design-In members
• Experience in using simulation software such as Computer-Aided Engineering (structural/vibration) or CST studio suite (EMC/EMI) Electromagnetic capability and Electromagnetic interference.
• Experience negotiating with Styling group and Cross-Functional departments.
• Experience in design of electrical systems/parts.
• Experience in design of other ADAS systems such as Panoramic View Monitor, Sonar, and Blind Spot Monitor, or Headlamp ECU.
• Japanese language capability.