Field Services Engineer

Job Title: Field Services Engineer

Location: On Site - Boise, Idaho, United States

Salary: $75,000-$90,000 (plus OT pay)

Travel: 20%

Shift Rotation: Alternating 3 days on / 4 days off and 4 days on / 3 days off (12 hour shift)

Skills: RTP, RTA, Veeco, thermal process, wafer processing

About the Semiconductor Manufacturing Company / The Opportunity:

Join a leading organization in the semiconductor manufacturing industry supporting advanced laser annealing and wafer processing equipment. This hands-on, customer-facing opportunity offers the chance to install, maintain, troubleshoot, and optimize complex manufacturing systems in a high-volume cleanroom environment. As a Field Services Engineer, you will serve as a technical resource for customers and internal teams while helping improve equipment reliability and operational performance.

Responsibilities:

• Install, maintain, troubleshoot, and repair advanced semiconductor manufacturing equipment at customer facilities.
• Perform mechanical, electrical, and software diagnostics to identify and resolve equipment issues.
• Lead daily field service activities, coordinate assignments, and manage shift handoffs and service reporting.
• Serve as a technical escalation point for installation, maintenance, and equipment-related challenges.
• Provide technical guidance and on-the-job training to technicians, junior engineers, and customer personnel.
• Perform failure analysis and implement corrective and preventive actions to improve equipment reliability.
• Execute equipment upgrades, software updates, hardware modifications, and replacement parts coordination.
• Maintain accurate service documentation while following customer, company, regulatory, and cleanroom safety requirements.
• Respond to emergency service requests and support domestic and international customer, training, and factory activities as needed.

Must-Have Skills:

• Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Manufacturing Engineering, or a related technical discipline.
• At least three years of experience in semiconductor equipment field service, customer service, equipment engineering, or a related technical role.
• Strong mechanical and electrical troubleshooting skills with experience supporting complex manufacturing equipment.
• Ability to interpret technical documentation, schematics, diagrams, and equipment data.
• Strong problem-solving, failure-analysis, organizational, and documentation skills.
• Excellent written and verbal English communication skills with a customer-focused approach.
• Ability to work independently, lead field activities, and collaborate effectively with technical teams.
• Willingness to work 12-hour shifts, weekends, holidays, extended shifts, and non-traditional schedules.
• Ability to work in semiconductor cleanrooms while complying with PPE, safety, mobility, and physical requirements.
• Valid driver’s license, valid passport, and authorization to work in the United States without sponsorship.

Nice-to-Have Skills:

• Experience supporting laser annealing, rapid thermal processing, RTP/RTA, thermal processing, or other wafer-processing equipment.
• Experience with Veeco or other semiconductor equipment manufacturers.
• Previous experience as a Senior Field Service Engineer, Field Service Lead, Shift Lead, or Technical Lead.
• Experience training or mentoring junior engineers and technicians.
• Experience working directly with semiconductor fabs or major semiconductor manufacturers.
• Hands-on experience troubleshooting both equipment hardware and software.
• Willingness and ability to travel domestically and internationally, including to Japan, Singapore, Taiwan, France, and other locations.