What are the responsibilities and job description for the Packaging Engineer position at TalentAlly?
Job Description
The Role and Impact
As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures.
You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments.
Your work will directly impact module-level performance, yield, reliability, and operational efficiency while helping shape Intel's future hybrid bonding technology roadmap.
Key Responsibilities
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications
Intel makes possible the most amazing experiences of the future. You may know us for our processors. But we do so much more. Intel invents at the boundaries of technology to make amazing experiences possible for business and society, and for every person on Earth. Harnessing the capability of the cloud, the ubiquity of the Internet of Things, the latest advances in memory and programmable solutions, and the promise of always-on 5G connectivity, Intel is disrupting industries and solving global challenges. Leading on policy, diversity, inclusion, education and sustainability, we create value for our stockholders, customers, and society.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $172,200.00-$243,000.00
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
PDN-a25ddf9c-171d-4167-b61f-94f26686a492
The Role and Impact
As a Senior HBI Module Development Engineer for Die-to-Wafer Hybrid Bonding (HBI), you will drive equipment development and manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures.
You will bring deep technical expertise in hybrid bonding process or equipment engineering, contributing to both first-of-a-kind (FOK) platform development and optimization of manufacturing processes to support development and high-volume manufacturing environments.
Your work will directly impact module-level performance, yield, reliability, and operational efficiency while helping shape Intel's future hybrid bonding technology roadmap.
Key Responsibilities
- Drive process and/or equipment manufacturing development for die-to-wafer hybrid bonding, including parameter optimization, equipment characterization, and process control.
- Develop and optimize manufacturing processes to improve yield, reliability, and defectivity performance.
- Improve bond interface quality, alignment performance, overlay accuracy, surface preparation, and contamination control.
- Design and execute DOE-based experiments and perform statistical analysis to establish robust process windows and control strategies.
- Lead first-of-a-kind (FOK) process and equipment capability development for new bonding platforms and technologies.
- Identify and implement process and equipment improvements to enhance manufacturing capability, efficiency, and output.
- Conduct process feasibility studies using characterization, modeling, simulation, and experimental methodologies.
- Partner with equipment suppliers and materials vendors to develop enabling process and hardware solutions.
- Collaborate with technology development, process integration, and manufacturing organizations to drive process maturity and continuous improvement.
- Contribute to future technology roadmaps through evaluation of emerging hybrid bonding technologies.
- Demonstrated ability to solve complex technical problems using structured engineering methodologies.
- Strong written and verbal communication skills with the ability to present technical findings to diverse audiences.
- Ability to influence and collaborate across cross-functional teams in technology development and manufacturing environments.
- Proven ability to mentor and develop engineers and technical team members.
- Demonstrated ability to manage multiple priorities and drive results in a fast-paced environment.
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications
- Bachelor's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 9 years of industry experience; OR
- Master's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 6 years of industry experience; OR
- PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 5 years of industry experience.
- 5 years of industry experience in hybrid bonding, wafer bonding, advanced packaging,
- Experience leading first-of-a-kind (FOK) process or equipment development programs.
- Experience introducing new hybrid bonding platforms, manufacturing capabilities, or advanced packaging technologies.
- Knowledge of bond interface defect mechanisms, including void formation, adhesion challenges, contamination effects, and material interactions.
- Experience with alignment-sensitive manufacturing processes and overlay performance optimization.
- Experience with process characterization, metrology, defect inspection, or failure analysis techniques.
- Experience improving equipment capability, throughput, utilization, or process performance in a manufacturing environment.
- Experience collaborating with external equipment suppliers and materials vendors on technology development activities.
- Experience supporting technology transfer from development to manufacturing.
Intel makes possible the most amazing experiences of the future. You may know us for our processors. But we do so much more. Intel invents at the boundaries of technology to make amazing experiences possible for business and society, and for every person on Earth. Harnessing the capability of the cloud, the ubiquity of the Internet of Things, the latest advances in memory and programmable solutions, and the promise of always-on 5G connectivity, Intel is disrupting industries and solving global challenges. Leading on policy, diversity, inclusion, education and sustainability, we create value for our stockholders, customers, and society.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $172,200.00-$243,000.00
- Salary range dependent on a number of factors including location and experience
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
PDN-a25ddf9c-171d-4167-b61f-94f26686a492
Salary : $172,200 - $243,000