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Medical Device Packaging Engineer

SPECTRAFORCE
Warsaw, IN Contractor
POSTED ON 10/27/2026
AVAILABLE BEFORE 11/25/2026

Position Title: Packaging Engineer II

Work Location: Warsaw, Indiana

Assignment Duration: 12 months

Work Arrangement: Onsite

Position Summary: Packaging Engineer supporting packaging DHF Remediation and EOL support

Objective: Establish a baseline understanding of packaging-related DHF content and identify gaps relative to regulatory and our organization requirements.

Key Responsibilities:

  • Review existing DHF documentation related to packaging design, materials, testing, labeling, and validation
  • Identify applicable standards and regulations (e.g., ISO 13485, ISO 11607-1 and ISO 11607-2, 21 CFR 820, EU MDR)
  • Assess completeness and compliance of packaging documentation within the DHF
  • Identify gaps related to packaging design inputs/outputs, validation, aging, and labeling
  • Coordinate with quality, regulatory, and project stakeholders to confirm expectations

Qualification & Experience:

  • Bachelor's Degree and 1 years of relevant experience, or Associate's Degree and 3 years of relevant experience, or High School Diploma or Equivalent and 5 years of relevant experience

Deliverables:

  • Packaging-focused DHF assessment report
  • Packaging gap analysis matrix
  • Regulatory and standards alignment summary
  • Packaging remediation plan and timeline


Applicant Notices & Disclaimers

  • For information on benefits, equal opportunity employment, and location-specific applicant notices, click here


At SPECTRAFORCE, we are committed to maintaining a workplace that ensures fair compensation and wage transparency in adherence with all applicable state and local laws.

Salary : $55 - $55

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