What are the responsibilities and job description for the Senior Package Engineer position at Rapidus Corporation?
- Provide expert technical support for assembly and test development with a focus on advanced chiplet and multi-die packaging.
- Partner with customers to clarify technical requirements, align specifications, and resolve design and integration issues.
- Guide interposer design, multi-die integration, and system-level packaging considerations.
- Collaborate with cross-functional teams across design, development, test, and packaging to overcome technical challenges.
- Develop and deliver clear, well-structured technical documentation and presentations for both internal stakeholders and customers.
Required Qualifications
- Proven hands-on experience in 2.5D / 2.xD / 3D chiplet or multi-die packaging design.
- Strong knowledge of interposer design and advanced packaging technologies.
- Familiarity with system-level validation, test methodologies, and productization processes.
- Demonstrated ability to work directly with customers and collaborate across diverse technical teams.
Preferred Qualifications
- Expertise in high-bandwidth interconnects, HBM integration, or multi-chip module design.
- Understanding of thermal management, signal integrity (SI), and power distribution in advanced packaging.
- Experience in customer-facing technical roles and/or technical program management.