What are the responsibilities and job description for the Process Engineer position at Power Integrations?
Description
Wafer Fab Process Engineer will work in the class 100 semiconductor facility and will perform multiple operations including: cleaning and coating wafers; aligning wafers using mask aligners, metal/dielectric deposition and etching, baking and annealing, inspections, performing tool calibrations, carry out DOE runs analyze and report data.
Working hours will be 10:00am – 7:00pm with flexibility to cover portion of the second shift as needed
Experience
Candidate must have 2 years experience with contact/stepper lithography, e-beam evaporation/ Sputtering, lift-off process, RTP, Furnace anneal, ALD, PECVD of SiO2 and Si3N4 and RIE/ICP processes of dielectrics and semiconductors materials.
Education
BS in Science, Engineering or equivalent.
Wafer Fab Process Engineer will work in the class 100 semiconductor facility and will perform multiple operations including: cleaning and coating wafers; aligning wafers using mask aligners, metal/dielectric deposition and etching, baking and annealing, inspections, performing tool calibrations, carry out DOE runs analyze and report data.
Working hours will be 10:00am – 7:00pm with flexibility to cover portion of the second shift as needed
Experience
Candidate must have 2 years experience with contact/stepper lithography, e-beam evaporation/ Sputtering, lift-off process, RTP, Furnace anneal, ALD, PECVD of SiO2 and Si3N4 and RIE/ICP processes of dielectrics and semiconductors materials.
Education
BS in Science, Engineering or equivalent.