What are the responsibilities and job description for the Assembler position at PlanIT Group, LLC?
Uses microscope to verify correct part placement and orientation, manually align parts before soldering and perform post re-flow inspection and touch-up.
Able to identify and touch up poor wetted solder joints, solder voids / insufficient solder, solder shorts/ bridges, misaligned parts / leads, tombstoned and or billboarded components and any other solder defects that may occur during the SMT operation.
Familiar with using Automated Optical Inspection (AOI) equipment to aid in identifying solder defects and understand what are false calls vs. real calls or issues
Must be able to read instructions and identify standard SMT components.
Must be able to work in a fast-paced environment where some overtime may be required.
Must be able to sit for long periods of time and focus on tedious tasks
Experience using rework equipment such as hot air pencils, hot plates, and BGA removal (ERSA or other OEM)
Experience reviewing boards under X-ray to identify solder defects on bottom terminated components
Experience running, soldering, and tacking down jumper wires on re-design boards is a plus
IPC-610 Certification (expired or active is a MUST)
IPC J-STD-001 Certification (expired or active is a MUST)
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