Senior Mechanical Engineer - Advanced Thermo-Mechanical

Piper Companies is seeking a Senior Mechanical Engineer – Advanced Thermo‑Mechanical to support a pioneering organization in the AI hardware sector for a permanent onsite role based in Saratoga, CA. The Senior Mechanical Engineer – Advanced Thermo‑Mechanical will serve as a technical authority driving the physics, modeling, and mechanical design of next‑generation semiconductor and system‑level packaging technologies.

Responsibilities of the Senior Mechanical Engineer – Advanced Thermo‑Mechanical include:

• Develop analytical and reduced‑order models to predict thermo‑mechanical responses in complex multi‑layer assemblies
• Lead nonlinear FEA simulations involving contact behavior, material deformation, thermal‑mechanical coupling, and compression mechanics
• Guide the mechanical architecture of advanced packaging structures, optimizing for structural stability, thermal performance, and long‑term reliability
• Plan and execute experimental validation efforts, including instrumentation strategies and correlation of simulation and test data
• Partner with cross‑functional engineering teams to ensure seamless integration between mechanical, electrical, thermal, and material domains
  
  

Qualifications for the Senior Mechanical Engineer – Advanced Thermo‑Mechanical include:

• Master’s degree or higher in Mechanical Engineering, Materials Science, or a closely related discipline
• 10 years of experience in semiconductor packaging, high‑density electronic systems, or mechanically intensive hardware environments
• Proven competence in nonlinear FEA tools such as ANSYS Mechanical or COMSOL Multiphysics
• Strong understanding of creep, fatigue, thermal expansion mismatches, and long‑term material behavior under combined loading
• Ability to connect analytical models, simulation insights, and empirical data into clear engineering recommendations
  
  

Compensation for the Senior Mechanical Engineer – Advanced Thermo‑Mechanical:

Salary Range: $200,000-$300,000/year (USD)

Comprehensive Benefits: Medical, Dental, Vision, sick leave if required by law, and 401K

This job opens for applications on 4/3/26. Applications for this job will be accepted for at least 30 days from the posting date.

Keywords: thermo‑mechanical modeling, FEA, ANSYS, COMSOL, mechanical reliability, semiconductor packaging, advanced packaging, multiphysics, creep, fatigue, contact mechanics, structural analysis, thermal cycling, high‑density electronics, system‑level design, material characterization, predictive modeling, structural optimization, experimental validation, instrumentation, reliability engineering, DFMEA, cross‑functional collaboration, physics‑based analysis, thermal‑mechanical coupling