Senior Electrical Engineer

Senior Electrical Engineer

Company Overview

Company is developing a next-generation AI wearable that combines ultra-high-density neural sensing with a Brain Foundation Model to decode neural signals and convert thought into text without surgery. The company is focused on advancing noninvasive brain-computer interface (BCI) technology, enabling real-time interaction between the human brain and AI. Their goal is to create a direct connection between mind and machine through an EEG-powered wearable platform designed for communication, productivity, and human augmentation.

Position Summary

Generalist with rotating focus. Moves across subsystems as work demands, picks up a primary domain at a time (power, RF, sensor analog, communication buses) and rotates as priorities shift.

Works under the Lead EE's architectural direction. Collaborates with audio, camera, biosensor, and PD leads who specify subsystem requirements. Works extensively with external engineering teams at CMs, the work is outsourced; the accountability is shared with the Lead.

Responsibilities

• Own subsystem-level electrical design under the Lead EE's architectural direction.
• Take an assigned subsystem from spec through schematic, layout review, fab release, and bring-up.
• Rotate across primary domains as the roadmap demands.
• Run hands-on bring-up and debug with scope, logic analyzer, spectrum analyzer, and network analyzer.
• Partner with audio, camera, and biosensor leads to translate subsystem requirements into electrical design.
• Partner with firmware on bring-up.
• Drive part selection and BOM contribution within assigned subsystems.
• Drive external CM engagement.
• Sensor domain expertise not required.
• Generalist EE able to work across multiple domains.

Requirements:

• 5 years EE on consumer hardware, at least one shipped product where you owned a subsystem end-to-end.
• Ultra-low-power MCU subsystems, power gating, sleep modes, peripheral integration, bus-level design.
• Power subsystems, battery management, multi-rail regulation, charging, dynamic power budgeting.
• RF and wireless subsystems, antenna design or integration, layout for RF, body-proximity tuning, multi-radio coexistence.
• Schematic capture and PCB layout direction across mixed-signal designs.
• Strong lab instincts, scope, logic analyzer, spectrum analyzer, network analyzer.
• Partnering closely with firmware on subsystem bring-up and debug.
• Overseas CMs, fab, assembly, DFM iteration.
• Strong understanding of signal integrity, analog circuits, and signal chains.
• Experience working with analog signal acquisition and processing.
• Experience with MCU subsystems and embedded hardware architectures.
• Ability to collaborate with firmware engineers on hardware/software integration.
• Systems and architecture-level design experience preferred.

Desired Skillsets:

• Flex or rigid-flex PCB experience.
• Biopotential or precision sensor AFE experience.
• Battery management or PMIC integration on multi-cell architectures.
• Audio-class analog or Class-D amplifier integration.
• Image sensor electrical interfaces.
• Early-stage or contract experience at a consumer hardware startup.
• Ability to independently bring up and debug hardware boards.
• Experience with board design and DFM (Design for Manufacturability)
• Proven ability to deliver hardware designs through production.
• Experience partnering with Product Design (PD) teams.
• Ability to translate high-level architecture requirements into hardware designs.
• Experience collaborating with EE teams throughout the development lifecycle.
• RF subsystem experience is preferred.

Location: Palo Alto, CA (Hybrid Schedule, 2 days/week in office)

Duration: 12-month contract with extension/conversion possibilities

Pay Rate Range: $80 to $105/h (DOE)

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