Test, Assembly, and Packaging Co-Op (Flip Chip Packaging)

Test, Assembly, and Packaging Co-Op (Flip Chip Packaging)

Category: Engineering Subscribe: New Job Alerts

RSS Job Feed Department: Engineering Locations: Rochester, NY Posted: Nov 5, 2025 Closes: Apr 30, 2026 - 11:59 PM EDT Type: Internship Salary Type: Hourly Salary Range: $25.00 - $25.00 Position ID: 194529

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About NY Creates:

NY Creates serves as a bridge for advanced electronics, leads projects that advance R&D in emerging technologies, and generates the jobs of tomorrow. NY Creates also runs some of the most advanced facilities in the world, boasts more than 3,000 industry experts and faculty, and manages public and private investments of more than $25 billion - placing it at the global epicenter of high-tech innovation and commercialization.

Job Description:

Job Summary

The student will be involved in assembly and manufacture of silicon optoelectronics devices on wafer level as well as on the device level. The student will be working with sophisticated state of the art wafer and device assembly equipment which may include photolithography, wafer bumping, singulation, pick & place, die attach, wire bond, flip chip, underfill and solder reflow machines.

Job responsibilities include but are not limited to:

• Operating equipment to assemble Opto-electronic devices with good yields and high integrity.
• Design of experiment to collect and analyze data to improve manufacturing processes.
• Run assembly equipment to fabricate parts with good yields and collecting data on silicon photonics assembly projects.
• Compare different designs, different materials or different machine parameters to improve performance and yields.
• Diagnose failures using various characterization, test and analytical instruments including die shear, wire-pull, X-ray and CSAM.
• Work inside the clean room and learning from a dynamic cross-functional multi-diverse team.
• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
• Other reasonable duties as assigned
  
  

Requirements:

Minimum Requirements

• Undergraduate majoring in engineering degree including chemical, materials or mechanical engineering.
• Experience in Mechanical Engineering or Chemical Engineering to focus on advanced microelectronic flip chip packaging.
• Must be interested in hands-on assembly of devices and operating precision equipment.
• Courses in and experience in semiconductor fabrication, materials science, CAD and 3D printing are a plus.
• Available full-time on-site for 16 weeks continuously to work as intern or coop for school credit.
• Able to work legally in US.
  
  

This position is contingent on the satisfactory completion of a background check.

Salary Range: $25.00 / hr

Additional Information:

NOTE: Some positions require access to export-controlled commodities, technical data, technology, software, or restricted programs where U.S. Government authorization may be required.

For positions requiring such access, offers of employment are contingent upon the employer being able to obtain the necessary authorization, including, if required, an export license from the U.S. Department of Commerce's Bureau of Industry and Security, the U.S. Department of State's Directorate of Defense Trade Controls, or other government agencies. The decision to pursue an export license application is at The Research Foundation for SUNY's sole discretion. Proof of status may be required prior to employment in connection with necessary authorizations.

Employment is with the Research Foundation for SUNY. The Research Foundation is an Equal Opportunity Employer, including individuals with disabilities and protected veterans.

In compliance with the Americans with Disabilities Act (ADA), if you have a disability and require a reasonable accommodation to apply please call Human Resources at 518-437-8686.