What are the responsibilities and job description for the Sr. Metrology/Photolithography Process Engineer position at NXP Semiconductors?
Business Line Description:
NXP’s Front End Operations plays an essential role in the company’s success by ensuring manufacturing excellence and delivery of high quality, scalable, and cost-competitive semiconductor devices to create a winning advantage for our Customers.
Job Summary:
Photolithography/Metrology Process Engineer in a high-volume semiconductor wafer manufacturing environment. Prior experience with semiconductor manufacturing process is required. Previous experience with ASML Scanner, Canon Stepper, TEL ACT 8 or Mark 7 track, KLA 8100 CDSEM/Archers/UVs/ASET/HRPs, Onto IRIS is highly desirable.
Key Challenges:
- Reducing overall cost of non-conformal like wafer scrap, and Photo rework
- Developing and writing standard work procedure document for Out of Control Action Plan
- Implementation of process SPC using Six-Sigma statistical methodology
- Improving tool utilization and availability
- Working with manufacturing and industrial engineering for capacity planning and modeling
- Participating in and/or leading cross-functional and lean activity teams
- Supporting process development activities
- Sourcing and process releasing new equipment
- Training process technician in dispositioning of wafer in process out of control situations
- Training wafer FAB associate in process tool operation using our standard work process
Cross functional aspects:
- Working closely with Photo/Metrology equipment team to identify and reduce source of process variation and implementing zero defect process
- Collaborate with device team to improve process integration margin
Job Qualifications:
- Must have a BS or MS degree in engineering or a degree in relevant field of studies
- More than 5 years of process engineering experience in a similar high volume semiconductor manufacturing environment
- Six-Sigma statistical methodology
Salary : $105,000 - $120,000