What are the responsibilities and job description for the Principal Photolithography Equipment Engineer position at NXP Semiconductors?
Business Line Description
NXP’s Front End Operations plays an essential role in the company’s success by ensuring manufacturing excellence and delivery of high quality, scalable, and cost-competitive semiconductor devices to create a winning advantage for our Customers.
Job Summary
Photolithography Equipment Engineer in a high-volume semiconductor wafer manufacturing environment. Prior experience with semiconductor manufacturing process is required. Previous equipment experience with ASML Scanner PAS5500/400/700 Scanners is required. Experience with Canon Stepper, TEL ACT 8 or Mark 7 track, KLA 8100 CDSEM/Archers/UVs/ASET/HRPs, Onto IRIS is desirable.
Key Challenges
NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.
NXP’s Front End Operations plays an essential role in the company’s success by ensuring manufacturing excellence and delivery of high quality, scalable, and cost-competitive semiconductor devices to create a winning advantage for our Customers.
Job Summary
Photolithography Equipment Engineer in a high-volume semiconductor wafer manufacturing environment. Prior experience with semiconductor manufacturing process is required. Previous equipment experience with ASML Scanner PAS5500/400/700 Scanners is required. Experience with Canon Stepper, TEL ACT 8 or Mark 7 track, KLA 8100 CDSEM/Archers/UVs/ASET/HRPs, Onto IRIS is desirable.
Key Challenges
- Identification and reduction of reoccuring machine faults
- Creation of hard down action plans driving to root cause
- Developing and improving tool maintenance procedures
- Training maintenance technicians
- Reducing overall cost of equipment and scrap
- Improving tool utilization and availability
- Participating in and/or leading cross-functional and lean activity teams
- Supporting process development activities
- Sourcing and releasing new equipment
- Training maintenance technicians
- Knowledge of Six-Sigma root cause problem solving, SPC, 8D, FMEAs
- Working closely with Photo process team to identify and reduce source of process variation and implementing zero defect process
- Must have a BS or MS degree in engineering or a degree in relevant field of studies
- More than 5 years of process engineering experience in a similar high volume semiconductor manufacturing environment
- Prior experience with semiconductor manufacturing process is required.
- Previous equipment experience with ASML Scanner PAS5500/400/700 Scanners is required.
- Experience with Canon Stepper, TEL ACT 8 or Mark 7 track, KLA 8100 CDSEM/Archers/UVs/ASET/HRPs, Onto IRIS is desirable.
NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.
