What are the responsibilities and job description for the Plate Semiconductor Equipment Technician position at NXP Semiconductors?
Role Summary
The Plate Equipment Maintenance Technician opportunity is in a high-volume
semiconductor wafer manufacturing environment. The position is responsible for correctly maintaining, troubleshooting and repairing complex semiconductor manufacturing equipment to achieve manufacturing process yield and productivity goals.
Job Responsibility
NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.
The Plate Equipment Maintenance Technician opportunity is in a high-volume
semiconductor wafer manufacturing environment. The position is responsible for correctly maintaining, troubleshooting and repairing complex semiconductor manufacturing equipment to achieve manufacturing process yield and productivity goals.
Job Responsibility
- Troubleshoot and repair all hardware and process failures across a diverse system family of Plating systems
- Perform preventive maintenance activities following standardized work documents.
- Use SPC and fault detection software and charts to evaluate tool performance and
- Document maintenance activities and assist in improving standardized work documents for scheduled and unscheduled maintenance tasks.
- Assist engineering team with equipment upgrades, improvements and long down troubleshooting
- Maintain spare parts inventory and various other activities related to the success of the area
- Daily continued use of analytical problem solving and system testing skills to attain
- Demonstrate a self-motivated mindset; and be able to take initiative to address
- Exhibit the ability to deal with multiple issues and shifting priorities on a continued basis
- Interact with multiple disciplines in a 7x24 manufacturing facility, either on shift or cross shift to maintain production flows
- Employ strong data analysis, troubleshooting, teamwork, and communication skills
- Exploit a solid knowledge of SPC and FDC and their uses for troubleshooting, and making system improvements with the Engineering team
- Continually adapt and nurture a desire to learn new skills whenever the opportunity presents itself
- Thrive in a multi-cultural environment. Display respect and integrity with other team members
- HS Diploma or GED required, AA preferred
- Minimum of 5 years semiconductor manufacturing experience..
- Experience with advanced electronics, equipment troubleshooting, installation, repair and operation of Semiconductor electro plating equipment.
- LAM Sabre Backside Etch
- Semitool Millenium
- DNS Scrubbers
- Must be able to read schematics and complex drawings/diagrams
- Must be physically capable of standing for long periods of time as well as lifting and carrying objects up to 50 pounds
- Ability to work well in a diverse team environment and multitask with minimal supervision while adjusting to changing priorities
NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.