What are the responsibilities and job description for the Sr MOL Engineer - DRAM Process Integration position at Micron Technology?
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Micron is a global DRAM leader whose innovative designs are pushing the boundaries of what's possible in the future of semiconductors. We are seeking a motivated Process Integration Engineer to join our MOL (Middle-Of-Line) team within DRAM Research & Development. This role is ideal for recent graduates or early-career engineers who are eager to develop deep expertise in semiconductor process integration, contact formation, local interconnect, and the critical interface between Middle-Of-Line (MOL) and Capacitor (Cap) layers.
You will work alongside experienced integration engineers to develop, optimize, and transfer advanced DRAM MOL process flows. The MOL module is central to device performance — it includes contact etch, silicide formation, contact fill, and local interconnect patterning. Strong fundamentals in materials science, electrical engineering, or a related discipline are essential. Prior semiconductor experience is valued but not required — we invest in developing our engineers.
Responsibilities
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn about your right to work click here.
To learn more about Micron, please visit micron.com/careers
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Micron is a global DRAM leader whose innovative designs are pushing the boundaries of what's possible in the future of semiconductors. We are seeking a motivated Process Integration Engineer to join our MOL (Middle-Of-Line) team within DRAM Research & Development. This role is ideal for recent graduates or early-career engineers who are eager to develop deep expertise in semiconductor process integration, contact formation, local interconnect, and the critical interface between Middle-Of-Line (MOL) and Capacitor (Cap) layers.
You will work alongside experienced integration engineers to develop, optimize, and transfer advanced DRAM MOL process flows. The MOL module is central to device performance — it includes contact etch, silicide formation, contact fill, and local interconnect patterning. Strong fundamentals in materials science, electrical engineering, or a related discipline are essential. Prior semiconductor experience is valued but not required — we invest in developing our engineers.
Responsibilities
- Support MOL process flow development, optimization, and integration for advanced DRAM technologies.
- Assist in troubleshooting integration issues across MOL process modules (contact etch, silicide, contact fill, local interconnect, liner/barrier).
- Collect, analyze, and interpret process and electrical data (contact resistance, leakage, yield) to drive improvement.
- Collaborate with cross-functional teams — MOL, Cap, module engineers, device engineers, reliability, and manufacturing — to resolve technical challenges at the MOL interface.
- Participate in technology transfer activities from R&D to pilot production.
- Contribute to design-of-experiment (DOE) planning, execution, and analysis for contact and local interconnect modules.
- Support pathfinding efforts for next-generation MOL architectures, materials, and contact scaling solutions.
- MS/PhD (preferred)/BS (required) in Electrical Engineering, Materials Science, Chemical Engineering, Microelectronics, Physics, Chemistry, or related field along with coursework or research in thin films, interconnect technology, or nanofabrication.
- Foundational understanding of semiconductor fabrication processes (thin film deposition, etch, lithography, CMP).
- Familiarity with MOL concepts: contact formation, silicide, local interconnect, liner/barrier films, contact resistance.
- Hands-on experience with deposition techniques (CVD, ALD, PVD) or etch processes.
- Exposure to DRAM or memory device technology paired with experience with process integration, yield improvement, or reliability testing.
- Internship or co-op experience in a semiconductor fab or R&D environment paired with experience with DOE (Design of Experiments) methodology.
- Knowledge of contact metallurgy: tungsten, cobalt, ruthenium, or other contact metals, paired with familiarity with silicide processes (TiSi, CoSi, NiSi) or metal-semiconductor interfaces.
- Understanding of high-aspect-ratio contact etch and fill challenges.
- Willingness to learn, adapt, and work in a fast-paced R&D environment paired with proficiency in statistical analysis tools: AI tool such as Claude Code…etc
- Knowledge of semiconductor reliability concepts (electromigration, contact degradation, stress voiding).
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn about your right to work click here.
To learn more about Micron, please visit micron.com/careers
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.