CMOS Device Integration Leader for Next‑Gen Memory

Micron Memory Malaysia Sdn Bhd

Boise, ID Full Time

POSTED ON 8/11/2026

AVAILABLE BEFORE 10/11/2026

What are the responsibilities and job description for the CMOS Device Integration Leader for Next‑Gen Memory position at Micron Memory Malaysia Sdn Bhd?

Micron Technology in Boise, Idaho seeks a Distinguished Member of Technical Staff to lead CMOS device integration for next-generation DRAM and memory architectu

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Salary.com Estimation for CMOS Device Integration Leader for Next‑Gen Memory in Boise, ID

$112,248 to $133,847

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What is the career path for a CMOS Device Integration Leader for Next‑Gen Memory?

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Integration Engineer III

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$108,740 - $126,996

Integration Engineer IV

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$134,729 - $158,988

Integration Engineering Manager

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$153,446 - $196,600

Integration Engineering Director

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$234,200 - $273,904

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CMOS Device Integration Leader for Next‑Gen Memory

What are the responsibilities and job description for the CMOS Device Integration Leader for Next‑Gen Memory position at Micron Memory Malaysia Sdn Bhd?

What is the career path for a CMOS Device Integration Leader for Next‑Gen Memory?

Not the job you're looking for? Here are some other CMOS Device Integration Leader for Next‑Gen Memory jobs in the Boise, ID area that may be a better fit.

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