What are the responsibilities and job description for the Program Engineer- Fabrication position at Massachusetts Institute of Technology?
Posting Description
PROGRAM ENGINEER, FABRICATION, MIT.nano , to support the Technical Concierge Service of the Northeast Microelectronics Coalition (NEMC) Hub. This role combines expert-level technical matchmaking, cross-facility coordination, hands-on microfabrication and characterization work; will help translate early-stage concepts into manufacturable processes by connecting users with the most appropriate facilities, expertise, and resources across the regional microelectronics ecosystem; serve as a key interface between academic researchers, industry partners, government organizations, and startups, ensuring efficient Lab-to-Fab translation and play a critical role in strengthening the regional microelectronics ecosystem, enabling researchers and innovators to rapidly access the infrastructure and expertise required to move ideas from concept to manufacturing.
A full job description can be found here: https://mitnano.mit.edu/opportunities/mitnano-job-opening-program-engineer-fabrication
Job Requirements
REQUIRED : Bachelor’s degree in electrical engineering, materials science, applied physics, microelectronics, or a related field; a minimum of seven years of related experience in a research environment (including graduate student experience); hands‑on experience with two or more microfabrication processes (e.g., lithography, etching, deposition, packaging, or device processing & testing); experience with materials or standard device metrology techniques relevant to microelectronics; strong ability to evaluate technical problems and propose practical experimental or fabrication pathways; and excellent communication skills and ability to work with multidisciplinary teams across academia and industry. PREFERRED : PhD in a related field; experience working in shared research facilities or user laboratories; experience developing SOPs or training materials; familiarity with semiconductor device fabrication, heterogeneous integration, or advanced packaging; and knowledge of regional and national microelectronics infrastructure networks.
This is a one-year appointment with potential for extension based on funding.
6/5/2026
PROGRAM ENGINEER, FABRICATION, MIT.nano , to support the Technical Concierge Service of the Northeast Microelectronics Coalition (NEMC) Hub. This role combines expert-level technical matchmaking, cross-facility coordination, hands-on microfabrication and characterization work; will help translate early-stage concepts into manufacturable processes by connecting users with the most appropriate facilities, expertise, and resources across the regional microelectronics ecosystem; serve as a key interface between academic researchers, industry partners, government organizations, and startups, ensuring efficient Lab-to-Fab translation and play a critical role in strengthening the regional microelectronics ecosystem, enabling researchers and innovators to rapidly access the infrastructure and expertise required to move ideas from concept to manufacturing.
A full job description can be found here: https://mitnano.mit.edu/opportunities/mitnano-job-opening-program-engineer-fabrication
Job Requirements
REQUIRED : Bachelor’s degree in electrical engineering, materials science, applied physics, microelectronics, or a related field; a minimum of seven years of related experience in a research environment (including graduate student experience); hands‑on experience with two or more microfabrication processes (e.g., lithography, etching, deposition, packaging, or device processing & testing); experience with materials or standard device metrology techniques relevant to microelectronics; strong ability to evaluate technical problems and propose practical experimental or fabrication pathways; and excellent communication skills and ability to work with multidisciplinary teams across academia and industry. PREFERRED : PhD in a related field; experience working in shared research facilities or user laboratories; experience developing SOPs or training materials; familiarity with semiconductor device fabrication, heterogeneous integration, or advanced packaging; and knowledge of regional and national microelectronics infrastructure networks.
This is a one-year appointment with potential for extension based on funding.
6/5/2026