What are the responsibilities and job description for the Senior Packaging Engineer (Microelectronics) position at Kforce Inc?
Responsibilities
Kforce is partnering with an innovative and rapidly growing communications technology company seeking to hire a Senior Packaging Engineer (Microelectronics) in the Tempe, AZ area (hybrid work schedule). Summary: This position would place you as the key Microelectronics Packaging Engineer on a talented space electronics engineering team, responsible for developing next-generation packaging solutions for advanced RF communications products supporting cutting-edge space systems. In this role, you would lead all aspects of microelectronics packaging development, working closely with RFIC, MMIC, and module design teams to create advanced packaging solutions for devices ranging from ICs and System-in-Package (SiP) designs to complex modules and sub-assemblies. Key areas of responsibility include:
We offer comprehensive benefits including medical/dental/vision insurance, HSA, FSA, 401(k), and life, disability & ADD insurance to eligible employees. Salaried personnel receive paid time off. Hourly employees are not eligible for paid time off unless required by law. Hourly employees on a Service Contract Act project are eligible for paid sick leave.
Note: Pay is not considered compensation until it is earned, vested and determinable. The amount and availability of any compensation remains in Kforce's sole discretion unless and until paid and may be modified in its discretion consistent with the law.
This job is not eligible for bonuses, incentives or commissions.
Kforce is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.
By clicking “Apply Today” you agree to receive calls, AI-generated calls, text messages or emails from Kforce and its affiliates, and service providers. Note that if you choose to communicate with Kforce via text messaging the frequency may vary, and message and data rates may apply. Carriers are not liable for delayed or undelivered messages. You will always have the right to cease communicating via text by using key words such as STOP.
Kforce is partnering with an innovative and rapidly growing communications technology company seeking to hire a Senior Packaging Engineer (Microelectronics) in the Tempe, AZ area (hybrid work schedule). Summary: This position would place you as the key Microelectronics Packaging Engineer on a talented space electronics engineering team, responsible for developing next-generation packaging solutions for advanced RF communications products supporting cutting-edge space systems. In this role, you would lead all aspects of microelectronics packaging development, working closely with RFIC, MMIC, and module design teams to create advanced packaging solutions for devices ranging from ICs and System-in-Package (SiP) designs to complex modules and sub-assemblies. Key areas of responsibility include:
- Developing advanced packaging architectures for RF communication products
- Defining package structures and materials to meet reliability, performance, manufacturability, and cost requirements
- Designing and developing semiconductor packages
- Driving the full package development lifecycle - package definition, stack-up, substrate layout, bond diagrams, drawings, predictive modeling, testing, and final release
- Utilizing thermal, mechanical, and electrical modeling to ensure early design success
- Leading technical engagement with external packaging vendors and manufacturing partners
- Supporting technology roadmaps and long-term packaging innovation initiatives
- Bachelor's degree in Electrical Engineering or related discipline
- Eight or more years of related semiconductor packaging engineering experience
- Strong knowledge of microelectronic package structure, mechanical, electrical and thermal performance
- Expertise in Outsourced Semiconductor Assembly and Test (OSAT)
- Knowledge of complex RF designs
- Strong communication and collaboration skills
We offer comprehensive benefits including medical/dental/vision insurance, HSA, FSA, 401(k), and life, disability & ADD insurance to eligible employees. Salaried personnel receive paid time off. Hourly employees are not eligible for paid time off unless required by law. Hourly employees on a Service Contract Act project are eligible for paid sick leave.
Note: Pay is not considered compensation until it is earned, vested and determinable. The amount and availability of any compensation remains in Kforce's sole discretion unless and until paid and may be modified in its discretion consistent with the law.
This job is not eligible for bonuses, incentives or commissions.
Kforce is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.
By clicking “Apply Today” you agree to receive calls, AI-generated calls, text messages or emails from Kforce and its affiliates, and service providers. Note that if you choose to communicate with Kforce via text messaging the frequency may vary, and message and data rates may apply. Carriers are not liable for delayed or undelivered messages. You will always have the right to cease communicating via text by using key words such as STOP.
Salary : $180,000 - $220,000