What are the responsibilities and job description for the Process Engineer – Semiconductor Heterogeneous Integration position at Keysight Technologies and Careers?
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Responsibilities:
This role emphasizes design enablement and advanced packaging architecture, working closely with upstream design teams. It differs from the Advanced Packaging role, which focuses on manufacturing execution and process development. Both roles collaborate closely on the same team but have distinct responsibilities.
Join our team to drive development and industrialization of advanced packaging technologies for next-generation System-in-Package (SiP) modules integrated with microwave and mmWave subsystems across Keysight, serving multiple industries such as wireless communications, aerospace, and automotive. This role is at the intersection of design development and process innovation, with a strong emphasis on heterogeneous integration—bringing together diverse semiconductor technologies into a single, high-performance package.
Responsibilities
- Collaborate with design teams to define packaging architectures and integration strategies.
- Develop design rules and guidelines for manufacturability and reliability.
- Evaluate new materials, interconnect technologies, and advanced packaging concepts.
- Perform feasibility studies and risk assessments for new designs.
- Partner with process and integration engineering and manufacturing teams to ensure smooth technology transfer.
- Support prototype builds and analyze performance data to refine design approaches.
- Drive innovation and lead projects in heterogeneous integration and advanced packaging for emerging markets like 6G.
- Drive technical and business process optimizations to meet Key Performance Indicators (KPI) targets and metrics.
- Manage multiple priorities, assess risks and tradeoffs, propose and implement solutions to mitigate risks.
- Regularly report progress and risks to cross-functional partners and upper management.
B.S., M.S., or Ph.D. in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or related field.- Strong analytical and problem-solving skills.
- Ability to collaborate effectively across design, process, and manufacturing teams.
- Excellent communication skills for technical discussions and cross-functional alignment.
Preferred Expertise
- Semiconductor packaging design and integration.
- Design for manufacturing and reliability.
- Advanced interconnect technologies (flip-chip, thermocompression bonding).
- Materials science for packaging applications.
- Statistical analysis and design of experiments (DOE).
- Familiarity with SiP (System in Package), SMT, and heterogeneous integration.
- Technical Project Management.
Careers Privacy Statement***Keysight is an Equal Opportunity Employer.***
The level of role will be based on applicable experience, education and skills; Most offers will be between the minimum and the midpoint of the Salary Range listed below.
California Pay range: $128,670.00 - $214,440.00
US Employees may be eligible for the following benefits:
- Medical, dental and vision
- Health Savings Account
- Health Care and Dependent Care Flexible Spending Accounts
- Life, Accident, Disability insurance
- Business Travel Accident and Business Travel Health
- 401(k) Plan
- Flexible Time Off, Paid Holidays
- Paid Family Leave
- Discounts, Perks
- Tuition Reimbursement
- Adoption Assistance
- ESPP (Employee Stock Purchase Plan)
- Restricted Stock Units
Salary : $128,670 - $214,440