Die Fab Process Engineering Technician

Keysight Technologies, the world's premier measurement company, has an opening for R&D Process Technician position at the High Frequency Technology Center in Santa Rosa, California. Live in beautiful Sonoma County amongst vineyards, redwood forests, rivers, lakes, and coastline while working on state-of-the-art ICs and devices.

R&D Wafer Fab Process Technician at HFTC is responsible for assisting engineers in process development and sustaining of custom, cutting edge, micro and nano-fabrication technologies for high performance microwave and millimeter-wave applications. The technologies include InP and GaAs-based HBTs, HEMTs, BOLT, and other advanced electronic components that enable key competitive differentiation of Keysight’s industry-leading RF, microwave, and high bit rate instruments.

The focus of this position is on Die Fab & Backside processes for current and future MMIC products, as well as advanced high frequency packaging development. These processes include MMIC wafer thinning, wafer separation (laser & saw), chip sort, visual inspection, outgoing quality, and heterogeneous integration of high frequency components. Responsibilities include but are not limited to the following:

• Ownership of Die Fab processes and equipment to drive production sustaining and R&D activities.
• Collaborate with Operations Group to implement robust process control; diagnose and resolve process problems. Prepare and maintain equipment and process documentation.
• Work closely with Process, Integration, Product, and Circuit Design Engineers to define process and device performance targets
• Assist engineers to define process flows, develop new fabrication processes, and drive continuous process improvement (CPI) efforts to maximize product yield
• Ensure successful transfer and maintenance of new technologies in manufacturing. Project objectives will encompass performance, reliability, and manufacturing goals.
• Assist with heterogeneous integration development projects that are critical to Keysight’s high frequency packaging roadmap
• Participate & assist in capital equipment acquisition projects that include tool evaluation, characterization, process development, and qualification.

• Minimum high school graduates with strong aptitude in science and math. Junior college or B.S. degree in STEM field is highly preferred.
• Minimum 3 years of relevant experience in Wafer Fab and/or Die Fab.
• Hands-on experience with advanced semiconductor device fabrication is required and specific skills in wafer separation, chip sort, automatic visual inspection, plasma etch, wet etch, and wafer thinning are highly preferred.
• Knowledge and experience with statistical process control (SPC) and design of experiments (DOE) is a valued qualification.
• Candidates must have excellent interpersonal, problem solving, and communication (oral & written) skills for successful inter and intra-group interactions.
• Self-motivated to learn new skills on their own or through training, and a willingness to teach that knowledge to the rest of the team

• Medical, dental and vision
• Health Savings Account
• Health Care and Dependent Care Flexible Spending Accounts
• Life, Accident, Disability insurance
• Business Travel Accident and Business Travel Health
• 401(k) Plan
• Flexible Time Off, Paid Holidays
• Paid Family Leave
• Discounts, Perks
• Tuition Reimbursement
• Adoption Assistance
• ESPP (Employee Stock Purchase Plan)
• Restricted Stock Units