Thermal/Mechanical Engineer

Location: California
Reports To: Vice President, Systems Engineering
Salary Range: $150,000 – $170,000

Overview

We are seeking a highly skilled Thermal/Mechanical Engineer to join a leading engineering team in the development of innovative thermal solutions for memory and storage products. This role will play a critical part in shaping next-generation technologies that support AI, cloud computing, and enterprise infrastructure.

Position Summary

The Thermal/Mechanical Engineer will design, model, and validate advanced thermal solutions for high-performance memory and storage hardware used by top-tier OEMs, ODMs, and hyperscale clients. The ideal candidate will combine deep technical expertise with hands-on design and problem-solving skills.

Key Responsibilities

• Create mechanical and thermal models of electrical and mechanical assemblies using CAD files or from scratch.

• Design or source thermal solutions for advanced memory and storage products.

• Run simulations to validate that thermal designs meet specified requirements.

• For custom solutions, specify required materials and prepare detailed fabrication and assembly drawings.

• Develop and implement Design of Experiments (DoEs) to evaluate thermal properties of assemblies.

• Collaborate with electrical engineering teams, providing feedback and design suggestions.

• Generate assembly drawings and ensure proper documentation of assembly processes.

• Partner with manufacturing to guarantee assemblies are built to specifications.

Qualifications

• Bachelor’s or Master’s degree in Mechanical Engineering, Thermal Engineering, or a related field.

• 8 years of industry experience in IC packaging design, thermal, or mechanical engineering.

• Proficiency in mechanical drawing tools such as AutoCAD and SolidWorks.

• Experience with thermal analysis and simulation tools such as Flowtherm or Icepak.

• Familiarity with thermal interface materials (heat sinks, spreaders, greases, gap pads, etc.) is desirable.

• Strong problem-solving abilities, attention to detail, and ability to innovate.

• Excellent communication skills, professionalism, and ability to work cross-functionally.

• Proven stakeholder management and influencing skills.

• Knowledge of memory and storage components (DDRx, LPDDRx, NAND) and modules (DIMMs, SSDs, etc.) is highly desirable.

• Willingness to travel occasionally (less than 10%).

Why This Role Stands Out

• Work on cutting-edge thermal solutions powering the next generation of computing and storage.

• Collaborate with world-class engineers in a fast-paced, innovative environment.

• Competitive salary and growth potential.