What are the responsibilities and job description for the Principal PCB and Substrate Layout Engineer position at JMD Technologies Inc.?
Title: Principal PCB and Substrate Layout Engineer
Location: Phoenix, AZ (Hybrid/Onsite preferred; Remote optional)
Employment Type: Contract (6 months)
Status: Accepting Candidates
About the role
Work on advanced PCB and high-density substrate/package layout design for complex RF, digital, and mixed-signal systems in a high-performance engineering environment.
Key Responsibilities
• Design high-density PCB and substrate layouts using Cadence APD
• Develop and implement substrate design rules for advanced packaging
• Work on 2.5D devices, interposers, flip-chip, die/package stacking
• Perform schematic/netlist-driven layout workflows
• Collaborate with mechanical teams for 3D fit and thermal validation
• Ensure compliance with JEDEC/IPC standards
• Support fabrication/assembly documentation and DFM activities
• Validate manufacturing data using CAM tools
Qualifications
• 10 years PCB or high-density package layout experience (Cadence APD )
• Bachelor’s degree in Engineering or equivalent experience
• Strong expertise in HDI stack-ups, microvias, and fine-pitch routing
• Experience with RF/digital/analog layout techniques
• Knowledge of advanced packaging (interposers, stacking, flip-chip)
• Familiarity with CAM tools (CAM350, Blueprint preferred)
• Strong understanding of fabrication and assembly processes
• Experience with industry standards (JEDEC/IPC)