What are the responsibilities and job description for the Process Integration Engineer position at Hisense Photonics?
Hisense Photonics Inc. is a high-tech chip design and manufacturing company located in South Plainfield, NJ. Hisense Photonics offers a full portfolio of semiconductor laser products including FP, DFB, EML, and SOA-based integrated chips, reaching speeds up to 56 Gps.
A Process Integration Engineer will lead the manufacturing and process development of III-V laser products. The primary responsibility will be to identify and resolve device performance and yield anomalies pertinent to wafer fabrication.
Responsibilities:
- Define process flow and mask layout for manufacturing of III-V semiconductor lasers
- Plan, monitor and control all phases of manufacturing processes in house
- Collaborate with epi, design, process, equipment and product engineering teams to maintain process stability and improve yield
- Identify process weaknesses and fabrication tool issues, propose and implement solutions for corrective actions
- Utilize the design of experiments and data analysis to optimize process
- Solve critical process issues and develop new fabrication techniques
Qualifications:
- MS or PhD in Electrical Engineering, Materials Science, Physics, or related fields
- Hands-on experience with semiconductor processing and wafer fabrication
- Experience with data mining and statistics, SPC and DOE.
- Ability to work in a cleanroom environment
- Basic knowledge of semiconductor lasers
- Excellent communication skills, able to collaborate with multi-functional teams