What are the responsibilities and job description for the Field Application Engineer position at Foxconn Interconnect Technology (FIT)?
Job Title: Field Application Engineer
Job Description:
FIT is looking for a Senior Field Application Engineer to join our San Jose office and majorly assist in engineering projects at EV/Energy accounts. This position will lead a small team to serve as the primary technical bridge between the Asia Engineering team and the customers. You will be responsible for the technical success of our high-power charging modules and integrated widget modules projects, ensuring seamless integration into next-generation EV. This includes technical communication with customers and factory engineers about the specifications & design features and design/DFM/validation deliverables through NPI programs. Also, the candidate needs to provide technical support in the projects and coordinate with teams between customer and Asia team to identify issues and resolve them in time. We look for candidates to be accountable for customer satisfaction, relationship management, problem solving, team management, and productive communication in cross-function teams.
Skills Preferred:
- 2 years of industry experience in FAE, technical support, or mechanical/electrical module design roles, GD&T, manufacturing process, FACA. Experiences with EV charging, & powertrain modules A plus.
- Preferred to be familiar with EV charging, communication protocol, module ME design, connector and cable assembly with their related standards.
- Possess excellent communication skills with customers for the technical information exchange and result delivery, both verbal and technical writing, and ability to translate "engineering speak" into business value.
- Act as the high-level technical expert on all design in activities and lead FACA for assigned products among customers and ODM, CM, and EMS subcontractors, and internally.
- Good management skills in collaborating with cross-function teams or members in the NPI projects to track all items for on-time delivery and provide assistance actively.
- Having understandings and experience in manufacturing processes (Injection molding/Stamping/ Die-casting/Top-Level Assembly).
- Ability to read and apply GD&T according to ASME/ISO standards.
- Technical Skill preferred: Catia, Pro-E, Solid works, etc.
- Good analytical & problem-solving skills.
- Must be self-motivated, self-disciplined, and think strategically.
- Willing to travel globally up to 20% annually.
- Language preferred: English and Chinese/Mandarin.
Education: Bachelor’s degree in engineering or science discipline, or equivalent experience with a track record of proven success. Master’s a plus.
Foxconn Interconnect Technology, Inc. (“FIT”) focuses on the development, manufacturing and marketing of electronic and optoelectronic connectors, antennas, acoustic components, cables and modules for applications in computers, communication equipment, consumer electronics, automobiles, industrial and green energy field products.
We offer our employees competitive compensation and world class benefits. In addition, we recognize the performance of the company, business unit and individual through our incentive and recognition programs. At FIT, base pay is one part of our total compensation package. Individual pay is determined by several factors including but not limited to geography, job related knowledge, skills, experience, and relevant education and/or training. FIT is an equal opportunity employer Minorities/Females/Protected Veterans/Disabled