What are the responsibilities and job description for the Field Application Engineer position at Foxconn Interconnect Technology (FIT)?
Job description
Job Title: Application Engineer
Job Location: San Jose, CA
Foxconn Interconnect Technology, Inc. (“FIT”) is seeking an experienced Field Applications Engineer to join as a valued member of sales team in the office.
Duties and Responsibilities:
· Reviews the 2D drawings and 3D CADs with both customers and back-end manufacturing engineers to identify potential issues and optimization.
· Work with assigned customer base in designing in FIT interconnect products along with the Account Management and Asia based business units.
· Reviews and presents DFM reports to customer, including FATP, plastic molding, metal stamping, etc., and converts customers' feedback into actionable items and follow through.
· Travels to Asia (manufacture sites) or remotely supports the product development, manufacturing, and quality control during the engineering build.
· Works collaboratively with the sales team to maintain the relationship with customers and to develop new business opportunities by promoting new solutions/technologies.
· Communicates with customer's technical teams on daily basis to ensure timely technical support.
Education and Experience:
· College B.S or B.A. degree in Mechanical Engineering or Electrical Engineering.
· At 0-4 years of FAE or design engineering experience in a mechanical or electrical engineering role.
· Customer interface and/or sales experience within an OEM assignment is a plus.
· Specific technically oriented experience with interconnect products within the Data Center industry is highly preferred
· Self-motivated and able to work with minimal supervision and utilize existing knowledge and sound judgement to thrive in a dynamic environment.
· CAD drafting capability: Solid works experience is a plus.
· Customer interface and/or sales experience in an OEM assignment is a plus. Experience with Finite Element Analysis is a plus
· Excellent communication and interpersonal skills
· Fluent in both English and Chinese (mandarin), oral and written.
· Able to travel internationally (mostly to Asia) up to 25%
Foxconn Interconnect Technology, Inc. (“FIT”) focuses on the development, manufacturing and marketing of electronic and optoelectronic connectors, antennas, acoustic components, cables, and modules for applications in computers, communication equipment, consumer electronics, automobiles, industrial and green energy field products.
We offer our employees competitive compensation and world class benefits. In addition, we recognize the performance of the company, business unit and individual through our incentive and recognition programs. FIT is an equal opportunity employer Minorities/Females/Protected Veterans/Disabled.