What are the responsibilities and job description for the IC Packaging Engineer position at Element Technologies?
IC Packaging Design Engineer
LOC: Chandler, AZ or Hillsboro, OR (ONSITE)
Longterm Contract – 1 Year
Bachelor’s or Master’s degree in Electrical /Electronics Engineering
Experience:
Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)
Candidates should have experience in the below domains:
Physical Design & Layout
Substrate design and layout
SI/PI aware design implementation
Design for performance, manufacturability, yield, and reliability
Design rule compliance