Process Development Engineer

Semiconductor Process Development Engineer – Advanced Packaging

Location: Chandler, Arizona – Onsite

Salary: $90,000–$110,000 5% Bonus Benefits

Travel: Approximately 25–30%

The Opportunity

We are supporting a specialist manufacturer of high-precision semiconductor equipment looking to appoint a Process Engineer to join its dedicated Applications and Process Development Lab in Chandler, Arizona.

This is an excellent opportunity for an engineer with a background in semiconductor process engineering, advanced packaging, materials or process development who enjoys analysing technical challenges, experimenting with process parameters and developing solutions.

Rather than supporting a high-volume production line, you'll work on a variety of customer projects, helping develop, optimise and validate advanced semiconductor packaging and assembly processes.

The Role

Working within a specialist applications laboratory, you'll collaborate with customers to understand their technical requirements and develop processes using high-precision die bonding and advanced packaging equipment.

Responsibilities will include:

• Developing and optimising semiconductor assembly and bonding processes.
• Analysing process parameters, materials and equipment performance to improve results.
• Conducting process trials, experiments and feasibility studies.
• Troubleshooting process challenges and performing root-cause analysis.
• Developing process recipes and identifying suitable operating parameters.
• Supporting customers with proof-of-concept projects and process validation.
• Documenting results and presenting technical findings to customers.

Projects will involve technologies including advanced semiconductor packaging, photonics, MEMS, optoelectronics and quantum computing.

What We're Looking For

We're particularly interested in engineers with 3 years of semiconductor process engineering or process development experience.

Ideally, you'll bring:

• Experience within semiconductor manufacturing, advanced packaging, assembly or related process development.
• Strong analytical and problem-solving skills.
• Experience conducting process trials, analysing results and optimising process parameters.
• An understanding of materials, process control, quality and yield.
• A practical, hands-on approach to engineering and experimentation.
• An interest in working directly with customers to solve complex technical challenges.

Why Consider It?

This is an opportunity to move beyond repetitive production processes and work on new and emerging semiconductor technologies, helping customers develop processes that may not have been attempted before.

You'll join a small, collaborative technical team, receive specialist equipment training and progressively take ownership of customer development projects.

Package: $90,000–$100,000 base salary, 5% bonus, fully paid employee health insurance, 5% 401(k) employer match and approximately three weeks' PTO.