Sr. Thermal Solutions Engineering Lead

About Chase Corporation

Founded in 1946 we have grown to become a global specialty chemicals company that is a leading manufacturer of protective materials for high-reliability applications across diverse market sectors.

Today we employ nearly 800 people and continue to grow and strengthen our business by employing a related diversification strategy that combines organic growth initiatives with strategic acquisitions.

Based in Westwood, Massachusetts, USA we operate manufacturing facilities in the United States, Europe, and Asia and continue to invest in our capabilities in order to deliver value to our global customer base demands.

Role Overview

The Senior Thermal Solutions Leader (TSL) will lead the technology roadmap and execution for polymer-based thermal interface materials (TIMs) and potting compounds used in advanced semiconductor packaging and high-density PCB applications. This role is rooted in applied materials science and formulation, with a focus on translating polymer systems, filler technologies, and processing conditions into differentiated package- and system-level thermal performance, reliability, and manufacturability.

The TSL will design and execute experimental programs, iterate formulations based on performance data, and mature materials from laboratory concepts through qualification and commercialization. This role partners closely with Product Development, Manufacturing, and Marketing, while also serving as a senior technical interface to customers. Target applications include high-thermal-load environments such as artificial intelligence infrastructure, data centers, and energy management and storage systems.

Key Responsibilities

Technology & Materials Development

• Lead formulation and optimization of polymer-based thermal interface materials (TIM1, TIM1.5, TIM2) and potting compounds for advanced semiconductor packaging.


• Apply structure–property relationships to guide formulation strategy, performance trade-offs, and portfolio evolution.


• Design and execute hypothesis-driven experimental programs linking polymer chemistry, fillers, and processing to thermal, mechanical, and reliability performance.


• Generate high-quality data to support stage-gate decisions, technical risk assessment, and commercialization.

Package-Level Evaluation & Reliability

• Build and evaluate package-level assemblies to assess material performance under realistic thermal, mechanical, and environmental conditions.


• Support reliability testing and qualification for high thermal flux and mechanically constrained packaging environments.


• Translate material-level results into package- and system-level performance implications.

Customer & Market Engagement

• Lead customer-facing technical engagement for thermal interface and potting materials in advanced semiconductor packaging.


• Translate customer requirements into R&D priorities while maintaining a focus on technology leadership.


• Partner with hyper scalers and contract manufacturers to accelerate adoption of next-generation thermal solutions in AI and data center applications.

Cross-Functional Collaboration

• Partner with Product Development, Manufacturing, and Marketing to ensure formulations are scalable, manufacturable, and aligned with portfolio strategy.


• Support portfolio validation by providing data, samples, and technical documentation to enable design-in and qualification.

Qualifications

• 7 years of industry experience developing, formulating, or validating polymer-based materials for semiconductor packaging, electronics assembly, thermal interface materials, or other high-reliability applications.


• Strong applied understanding of polymer chemistry, composite formulation, and additive systems, with the ability to link formulation design to thermomechanical performance.


• Experience applying structure–property relationships to manage performance trade-offs across TIM1, TIM1.5, TIM2, and potting compound applications.


• Working knowledge of PCB- and advanced-package-level thermal and mechanical environments, including processor packaging, lids/stiffeners, cold plates, and TIM selection and reliability considerations.

Education

• Bachelor’s degree in Materials Science, Polymer Science, Chemical Engineering, Electrical Engineering, or a related discipline. Advanced degrees preferred.