What are the responsibilities and job description for the TECHNICAL PROGRAM MANAGER #LCTPM072025 position at ASE Global?
JOB DUTIES: Support local sales teams in developing strategies to drive new business and expand market penetration for multinational IC packaging and testing services; promote the company’s capabilities to customers by helping them identify factories best suited to meet the business objectives; assist local customers in interfacing with worldwide factories to deal with NPI (new product introduction), production schedule, engineering queries, and quality issues; analyze semiconductor package trend in AI, power, robotics, and medical products; help customers translate new product concept into IC package; provide best package solutions to customers for advanced semiconductor packaging including FCCSP (C2iM), WDBGA, WLCSP; support customer in developing tech roadmaps, quality issue resolution, and business reviews; host regular meetings to connect customers and factories on ongoing projects, and visit local customers to provide technology updates and promote future product development.
REQUIRE: Bachelor’s degree in business administration. 2 years’ experience in job offered or as a Section Manager at a semiconductor packaging service provider. Experience in providing best package solution, NPI handling in FCCSP (C2iM) (Fan-Out Chip-on-Carrier (C2iM)), WDBGA (Wafer-Level Die Ball Grid Array), and WLCSP (Wafer-Level Chip-Scale Package).
Salary : $112,798 - $150,000
