SMT Process Engineer

SUMMARY

The Surface Mount Process Engineer is responsible for the development, optimization, and support of Surface Mount Technology (SMT) processes within a high-mix, low-to-medium volume PCBA contract manufacturing environment. This role ensures that all SMT production equipment, processes, and personnel operate effectively and efficiently to meet safety, quality, delivery, and cost goals. The Engineer serves as a subject matter expert (SME) in SMT and supports continuous improvement through data analysis, root cause investigation, and cross-functional collaboration.

RESPONSIBILITIES

• Provide technical leadership for SMT assembly processes, including stencil printing, solder paste inspection (SPI), pick and place, reflow soldering, X-ray, and automated optical inspection (AOI).
• Program and optimize SMT equipment (e.g., screen printers, pick and place machines, reflow ovens, SPI, AOI, and X-ray machines).
• Troubleshoot production issues and implement root cause corrective actions to eliminate process defects and downtime.
• Develop and maintain process documentation, including Manufacturing Work Instructions (MWIs), process control plans, and equipment setup procedures.
• Drive process improvement initiatives using Lean Manufacturing and Six Sigma principles to increase yields, reduce cycle times, and improve overall process efficiency.
• Perform Design for Manufacturability (DFM) reviews in collaboration with customers and design engineers to ensure product designs align with best manufacturing practices.
• Lead SMT line qualification activities, including equipment validation, process capability studies (CPK), and first article inspections (FAI).
• Monitor and analyze key performance indicators (KPIs) such as defect rates, line efficiency, and first pass yield (FPY).
• Provide training and technical support to operators and technicians to ensure proper process execution.
• Support Engineering Change Orders (ECOs) and new product introduction (NPI) activities to ensure smooth production ramp-up.
• Evaluate and qualify new materials, tools, and process technologies for SMT operations.
• Work with cross-functional teams to ensure adherence to IPC-A-610 and J-STD-001 standards for soldering and assembly.
• This position does not include direct supervisory responsibilities but may mentor or train junior engineers, technicians, and operators.
• Other duties may be assigned as required.

INTERNAL COMMUNICATION

• Collaborate with production, quality, test engineering, and planning departments to support day-to-day SMT operations.
• Coordinate with supervisors, technicians, and operators to address process issues and implement improvements.
• Support management with technical reports, process updates, and recommendations for operational improvements.

EXTERNAL COMMUNICATION

• Interface with equipment vendors, material suppliers, and customers to resolve process-related issues or to support technical reviews.
• Participate in customer audits, technical meetings, and DFM discussions as a technical representative of the manufacturing team.

QUALIFICATIONS

EDUCATION and/or EXPERIENCE

• Bachelor’s degree in Mechanical, Electrical, Industrial Engineering or a related technical field.
• 5–10 years of direct experience in SMT process engineering within a PCBA contract manufacturing environment.
• Strong experience with SMT equipment (e.g., DEK, MPM, Panasonic, Fuji, Yamaha, Juki, Heller, Vitronics, Koh Young, CyberOptics, etc.).
• Experience with high-reliability electronics for military, aerospace, or medical applications preferred.
• Familiarity with MES systems (e.g., Aegis, FactoryLogix), ERP systems, and SPC tools is a plus.

LANGUAGE SKILLS

• Ability to read, write, and interpret technical documents, machine manuals, and engineering drawings in English.
• Strong written and verbal communication skills to effectively interact with all levels of the organization and external parties.

TECHNICAL SKILLS Proficient in programming and operating SMT equipment including:

• Screen printers (e.g., DEK, MPM)
• Pick and place machines (e.g., Fuji, Yamaha, Panasonic, Juki)
• Reflow ovens (e.g., Heller, Vitronics) including thermal profiling
• SPI and AOI systems (e.g., Koh Young, CyberOptics, Mirtec)
• X-ray inspection systems for BGA, QFN, and hidden joint analysis
• Strong knowledge of SMT stencil design, solder paste behavior, and solder joint inspection criteria
• Skilled in Design for Manufacturability (DFM) and Design for Assembly (DFA) analysis
• Experienced in process documentation, work instruction development, and production routing using MES tools (e.g., Aegis FactoryLogix)
• Capable of performing process capability studies (Cp, Cpk) and statistical process control (SPC) analysis
• Proficient in root cause analysis and corrective action methodologies (8D, 5 Whys, Fishbone Diagram)
• Familiar with Lean Manufacturing, Six Sigma, Kaizen, and continuous improvement principles
• Working knowledge of IPC-A-610 and J-STD-001 standards for electronic assembly
• Comfortable using Microsoft Office Suite, especially Excel (pivot tables, data analysis, charts)
• Familiarity with ERP systems (e.g., SAP, Oracle, or similar) for BOM, ECO, and production control
• Experience with CAD/CAM software for PCB layout review (e.g., Altium, Mentor Valor) is a plus
• Understanding of ESD safety standards and proper handling procedures

REASONING ABILITY

• Demonstrated ability to troubleshoot complex process and equipment issues using structured problem-solving methods.
• Ability to prioritize and manage multiple projects simultaneously in a fast-paced environment.
• Strong analytical skills and a data-driven approach to process improvement.

CERTIFICATES, LICENSES, REGISTRATIONS

• IPC-A-610 and J-STD-001 certifications preferred.
• Six Sigma Green Belt or Lean Manufacturing certification is a plus.

PHYSICAL DEMANDS:

Regularly required to sit, stand, walk, and use hands to operate machinery or a computer.

• Occasional lifting of equipment or tools up to 25 lbs.
• Good hand-eye coordination and fine motor skills required for equipment operation and inspections.
• Must have visual acuity (20/20 corrected) and ability to distinguish colors for component identification and inspection.

WORK ENVIRONMENT

Work performed primarily on the manufacturing floor and in an engineering office environment.

• Frequent exposure to moderate noise levels from machinery and equipment.
• Occasional exposure to chemicals used in the SMT assembly process (handled per safety protocols).
• Must comply with all company safety and ESD (electrostatic discharge) procedures.