What are the responsibilities and job description for the Senior Product Lead - Advanced Packaging and Semiconductor Electronics position at ALTEN?
Job Description: Senior Product Lead - Advanced Packaging and Semiconductor Electronics
Company Overview
Join our team and be at the forefront of semiconductor technology innovation. We are looking for a highly skilled Senior Engineer to contribute to our cutting-edge projects in Advanced Semiconductor Packaging and AI. You will work alongside some of the brightest minds in the industry and have the opportunity to make a significant impact on the future of AI.
Position Overview
We are seeking a highly experienced Senior Product Lead with a robust background in Advanced Semiconductor Electronics and ASIC Design. The ideal candidate will possess extensive knowledge in mixed-signal design, chiplet design, and advanced packaging. This role demands a deep understanding of both BEOL and FEOL semiconductor processing, as well as current packaging and substrate technologies for advanced packaging.
Key Responsibilities
Company Overview
Join our team and be at the forefront of semiconductor technology innovation. We are looking for a highly skilled Senior Engineer to contribute to our cutting-edge projects in Advanced Semiconductor Packaging and AI. You will work alongside some of the brightest minds in the industry and have the opportunity to make a significant impact on the future of AI.
Position Overview
We are seeking a highly experienced Senior Product Lead with a robust background in Advanced Semiconductor Electronics and ASIC Design. The ideal candidate will possess extensive knowledge in mixed-signal design, chiplet design, and advanced packaging. This role demands a deep understanding of both BEOL and FEOL semiconductor processing, as well as current packaging and substrate technologies for advanced packaging.
Key Responsibilities
- Lead the product development lifecycle for cutting-edge semiconductor electronics and ASICs.
- Act as Technical Lead on Heterogeneous Integration projects using chiplet and advanced packaging technologies.
- Provide key insights and direction for the design, manufacture, and test of heterogeneously integrated systems using various chiplets, substrates, and advanced packaging.
- Define and document Advanced Packaging Architecture.
- Ensure the successful delivery of heterogeneous systems from Applied Materials with collaboration from our partners and/or ecosystem.
- Drive advancements in chiplet integration and high-speed chiplet I/O.
- Ensure signal and power integrity throughout the design and implementation phases.
- Stay abreast of the latest trends and technologies in advanced packaging and semiconductor processing.
- Collaborate with cross-functional teams to ensure seamless integration and timely delivery of projects.
- Mentor and guide junior engineers, fostering a culture of continuous learning and innovation.
- Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related field.
- At least 10 years of experience in semiconductor electronics and ASIC design.
- Proficiency in mixed-signal design and chiplet design.
- In-depth knowledge of advanced packaging, BEOL and FEOL semiconductor processing.
- Experience with current packaging technologies and substrate technologies for advanced packaging.
- Strong expertise in chiplet integration and high-speed chiplet I/O.
- Proven track record in ensuring signal integrity and power integrity in complex designs.
- Ph.D. in a relevant field.
- Experience with leading industry-standard design and simulation tools.
- Published works or patents in semiconductor technologies.
- Excellent leadership, communication, and project management skills.