What are the responsibilities and job description for the Senior Electrical Engineer - Advanced Semiconductor Packaging and Integration position at ALTEN?
Job Description: Senior Electrical Engineer - Advanced Semiconductor Packaging and Integration
Company Overview
Join our team and be at the forefront of semiconductor technology innovation. We are looking for a highly skilled Senior Engineer to contribute to our cutting-edge projects in Advanced Semiconductor Packaging and AI. You will work alongside some of the brightest minds in the industry and have the opportunity to make a significant impact on the future of AI.
Position Overview
We are seeking a Senior Electrical Engineer with a strong background in Advanced Semiconductor Electronics and ASIC Design. The ideal candidate will have extensive knowledge in mixed-signal design, chiplet design, and advanced packaging, with a deep understanding of BEOL and FEOL semiconductor processing.
Responsibilities
Company Overview
Join our team and be at the forefront of semiconductor technology innovation. We are looking for a highly skilled Senior Engineer to contribute to our cutting-edge projects in Advanced Semiconductor Packaging and AI. You will work alongside some of the brightest minds in the industry and have the opportunity to make a significant impact on the future of AI.
Position Overview
We are seeking a Senior Electrical Engineer with a strong background in Advanced Semiconductor Electronics and ASIC Design. The ideal candidate will have extensive knowledge in mixed-signal design, chiplet design, and advanced packaging, with a deep understanding of BEOL and FEOL semiconductor processing.
Responsibilities
- Lead the design and development of advanced semiconductor electronics and ASICs.
- Develop and optimize mixed-signal designs.
- Oversee semiconductor processing and advanced packaging technologies.
- Integrate HBM and LPDDR memory into system designs.
- Implement chiplet integration techniques focusing on high-speed chiplet I/O.
- Ensure signal and power integrity throughout the design process.
- Automate chip layout generation and format conversion.
- Design PCBs with a focus on performance and reliability.
- Conduct thermal simulations for optimal thermal management.
- Substrate design and documentation.
- Top-Level system design and floorplan.
- Overall ASIC and Chiplet design flow.
- Architecture documentation.
- EDA tools setup.
- Collaborate with cross-functional teams for seamless integration and timely delivery.
- Mentor and guide junior engineers.
- M.S in Electrical Engineering, Computer Engineering, or a related field.
- Extensive experience in advanced semiconductor electronics and ASIC design.
- Proficiency in mixed-signal design and semiconductor processing techniques.
- Strong knowledge of advanced packaging technologies, including HBM and LPDDR integration.
- Experience with chiplet integration and high-speed chiplet I/O.
- Expertise in signal integrity, power integrity, and automated chip layout generation.
- Proven track record in PCB design and thermal simulations.
- Excellent leadership, communication, and project management skills.
- Ph.D. in a relevant field.
- Experience with leading industry-standard design and simulation tools.
- Published works or patents in semiconductor technologies.