PCB Fabrication Process Engineer

WHAT YOU DO AT AMD CHANGES EVERYTHING

We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences – the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives. 

AMD together we advance_

THE ROLE:  

We are looking for a talented and energetic Lead Printed Circuit Board (PCB) fabrication process engineer to complement the existing skillsets of our Platform development team. In this role, you will be responsible for driving PCB performance, quality and reliability specifications: including but not limited to high-speed signal & power integrity (SI/PI) optimized stacks and interconnect structures for volume manufacturing. To accomplish this, you will interact frequently with key teams leading silicon/package design, board schematics/layout engineering, system validation, device failure analysis and supply chain/procurement activities within AMD, external industry consortiums, our customer teams, and strategic ODM & joint development partners. 

THE PERSON:  

As a Leader in Systems Design Engineering, you will be responsible for ensuring best-in-class performance and reliability of cutting-edge PCB designs. The suitable candidate will require a strong background & solid understanding of complex fabrication processes, high performance electronics hardware, and technical expertise in assembly reliability test/failure analyses. Effective communication skills, a collaborative mindset, detail-orientation, innovative critical problem solving/ troubleshooting, and organized data collection are critical qualities for success in this role.

KEY RESPONSIBILITIES:  

• Design high performance PCB material stacks & complex via-structure interconnects to enable AMD's next generation of Datacenter GPU Platforms
• Effectively address/close Design for Manufacturing queries in a timely manner to mitigate fabrication yield issues & de-risk on schedule delivery of critical builds
• Own manufacturing process qualification & adoption of PCB process technologies addressing product Signal Integrity, Power Delivery, and Thermal-Mechanical related performance specifications
• Identify & investigate novel PCB fabrication process techniques to evaluate alignment of these technologies to AMD’s DCGPU Platform roadmap
• Collaborate with silicon/package design, board engineering/layout, and other cross-functional teams to support PCB solutions from package to system level
• Contribute to overall product quality from conceptualization stage through NPI & mass volume production
• Drive process improvements while executing fast time-to-market product delivery
• Work effectively in a dynamic and fast-paced product development environment

PREFERRED EXPERIENCE:  

• Strong background in high-speed design, robust strategies for PCIe & Memory routing, and optimal PCB material selection dependent on application end-use
• Expertise in destructive and non-destructive device failure/root cause analyses using 3DXRM, SEM, Thermal analysis (DSC, DMA...etc.), and FTIR Spectroscopy
• Familiarity with 2D/3D Allegro (or other) Stack Impedance and Loss simulation tools required for SI/PI-focused interconnect optimizations
• Ability to write scripts in programming languages (i.e. Python, C/C , MATLAB, etc.) for statistical data analysis & tool development
• Excellent verbal & written communication skills at engineering and executive levels, including a proven track record of working effectively across organizational boundaries to define process requirements, solve complex problems and drive program-related investigations to successful completion
• Laboratory Acumen - Experience with Design of Experiments, instrumentation, data acquisition and analyses, including uncertainty analysis
• PCB Manufacturing - Sound knowledge of design & fabrication guidelines, including experience with volume manufacturing in Asia and North America

ACADEMIC CREDENTIALS:  

• Required - BS or MS degree in Engineering (Electrical/Computer/Mechanical/Chemical…etc.)

LOCATION: Austin, TX (Hybrid) 

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Benefits offered are described:  AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.   We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.