Mechanical Engineer

Position Description

Seeking an experienced Mechanical Engineer with strong structural and thermal analysis capabilities. The role includes performing structural, vibration, shock, fatigue, and thermal assessments for circuit card assemblies (CCAs) and chassis structures. Candidate will work independently to support design teams, generate analysis models, document results, and provide design recommendations.

Skills Required

Proficiency with NASTRAN for structural analysis - Ability to perform vibration, shock, static, and fatigue analyses - Ability to perform thermal modeling and assessments - Strong analytical, problem-solving, and independent work skills - Ability to clearly document and present technical results

Skills Preferred

Experience with CCAs and electronic chassis structures - Familiarity with Icepak for CCA thermal analysis - Experience using Simcenter 3D for system-level structural and thermal modeling - Exposure to pressure drop or coolant flow analysis (e.g., cold plates)

Experience Required

Structural and thermal analysis of mechanical components or electronic hardware - Experience with random vibration, shock, fatigue, and static loading analyses - Independent execution of analysis tasks and reporting

Analysis of solder joint reliability (low- and high-cycle fatigue) - Acoustic loading analysis - System-level analysis of electronic assemblies - Thermal and flow analysis of cooling solutions

Education Required

Bachelor’s degree in Mechanical Engineering or closely related field from an ABET-accredited institution