What are the responsibilities and job description for the Sr. Process Engineer position at XLR8 EMS?
We are seeking a highly skilled Manufacture Process Engineer to lead and optimize manufacturing processes for Printed Circuit Board Assemblies (PCBA). This role is critical in ensuring high-quality, reliable, and cost-effective production through expertise in stencil design, soldering processes, wave solder profiling, conformal coating, and secondary operations. The ideal candidate will bring deep technical knowledge, hands-on experience, and a continuous improvement mindset to advance our PCBA manufacturing capabilities.
- ️ Key Responsibilities
- Process Development & Optimization
- Design, validate, and optimize stencil designs for solder paste application.
- Develop and maintain reflow soldering profiles, including vapor phase reflow processes, to ensure robust solder joints and minimize defects.
- Establish and refine wave soldering profiles for through-hole components.
- Define and implement secondary operations including press-fit connector installation, heat sink attachment, and mechanical assembly steps.
- Develop and oversee conformal coating processes to ensure environmental protection and product reliability.
- Create and enforce rework standards for soldering, ensuring compliance with IPC and industry best practices.
- Manufacturing Support
- Provide technical leadership to production teams in troubleshooting assembly issues.
- Collaborate with design engineering to ensure manufacturability of PCB layouts and component selection.
- Drive yield improvement initiatives and root cause analysis for process-related defects.
- Lead Corrective and Preventive Action (CAPA) initiatives to eliminate recurring issues and strengthen process robustness.
- Support new product introduction (NPI) by developing scalable and repeatable assembly processes.
- Quality & Compliance
- Ensure adherence to IPC-A-610, J-STD-001, IPC-7711/7721, and other relevant industry standards.
- Maintain documentation of process parameters, work instructions, and control plans.
- Partner with quality engineering to implement corrective and preventive actions (CAPA).
- Continuous Improvement
- Lead projects focused on automation, efficiency, and cost reduction.
- Evaluate and introduce new technologies, equipment, and materials to enhance PCBA processes.
- Train and mentor junior engineers and technicians in advanced assembly techniques.
Qualifications & Experience
- Education: Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field. Master’s preferred.
- Experience: Minimum 7–10 years in PCBA manufacturing engineering, with proven expertise in:
- Stencil design and solder paste application.
- Reflow soldering (including vapor phase reflow) and thermal profiling.
- Wave soldering process development and optimization.
- Conformal coating application and process control.
- Secondary operations (press-fit connectors, heat sinks, mechanical assembly).
- Rework and repair standards for solder joints.
- Root cause analysis and CAPA methodologies for troubleshooting and issue resolution.
- Strong knowledge of IPC standards (IPC-A-610, J-STD-001, IPC-7711/7721).
- Hands-on experience with SMT equipment, AOI/X-ray inspection, and process monitoring tools.
- Demonstrated success in NPI process development and scaling to volume production.
- Excellent problem-solving, analytical, and communication skills.
- Ability to lead cross-functional teams and drive process improvements in a fast-paced environment.
Preferred Skills
- Experience with Design for Manufacturability (DFM) and Design for Test (DFT) principles.
- Familiarity with Lean Manufacturing and Six Sigma methodologies.
- Proficiency in CAD tools for stencil and fixture design.
- Knowledge of advanced soldering techniques (selective soldering, laser soldering).
- Strong project management and leadership capabilities.
Benefits
- 401(k)
- 401 (k) matching
- Dental insurance
- Health insurance
- Vision insurance
- Paid time off