Demo

Process Development Engineer, IC Design and Reticle Layout

Work Options Group
Temecula, CA Full Time
POSTED ON 5/22/2026
AVAILABLE BEFORE 6/20/2026
Description

The IC Design and Reticle Layout Process Development Engineer will be responsible to help support the development of manufacturable, repeatable, and high yielding processes for state-of-the-art highly specialized devices in the fields of Aerospace, Defense, Bioelectronics, and High-Speed Communications.

  • Partner with Integration Engineers, Customers, and Other Development Engineers to execute Manufacturing and Development programs, and adjust or optimize wafer layout for yields maximization, throughput and performance.
  • Partner with Product Engineering and Integration to help ensure effective new products introductions as well as consistent device performance and quality.
  • Guide and assist Customers and Integration Engineers through challenging manufacturing layout design rules.
  • Perform all tasks related to reticle design and mask layout supporting semiconductor manufacturing leveraging 193 nm scanners, i-line steppers, and 1x proximity g-line technologies.
  • Establish and maintain layout design rules related to metrology and process constraints. Metrology design rules include CDSEM, overlay, ellipsometry, profilometry, and electrical tests. Process design rules include creation of keep-out areas, minimum CDs, overlay constraints, and the generation of dummy load structures to maintain uniformity and process consistency.
  • Expand and maintain library of reusable unit components or structures with CAD software.
  • Analyze GDS layout files, verify quality and disposition tape-out / manufacturing of reticles based on data and pass/fail criteria.
  • Report and summarize results from the analysis and provide guidance to Customers and the Integration Engineering Team.
  • Provide effective pass-downs to support uninterrupted operation in the Photolithography area.
  • Sustain and improve processes for effective and efficient mask tape-out and fabrication.
  • Organize and track all versions of reticle layouts for internal and external customer products. Maintain database of existing mask sets.
  • Partner with reticle suppliers, customers and Integration engineers to improve tape-out cycle time and reticle manufacturing quality control.
  • Using Document Control, Process Work Instructions, and Manufacturing Execution Systems, preserve working knowledge of all codes and standards applicable to reticles design and layout.
  • Assure that the manufactured reticles conform to specifications and application requirements.

Requirements

Bachelor’s degree in Electrical Engineering, Computer Science, or Physics with 5 years of relevant experience, OR

Master’s degree in Electrical Engineering, Computer Science, or Physics with 2 years of relevant experience.

  • IC design, layout and reticle tape-out experience for a commercial foundry using CAD software
  • Experience with commercial layout software (Cadence, dw-2000, Mentor Graphics)
  • Deep understanding of DRC rules and their creation
  • Strong problem solving and critical thinking skills
  • Basic understanding of algebraic concepts
  • Data extraction, analysis, and reporting experience
  • Basic understanding of Semiconductor processing
  • Ability to troubleshoot basic problems and address root causes
  • Ability to plan and prioritize activities, perform and monitor multiple overlapping tasks/operations to meet goals and timelines
  • Strong communication, presentation and documentation skills
  • Must be able to work effectively in a dynamic start-up environment

Salary.com Estimation for Process Development Engineer, IC Design and Reticle Layout in Temecula, CA
$91,809 to $106,333
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