What are the responsibilities and job description for the Equipment Engineer - TSE KEG position at TSP Talent?
Role Overview: The TSE KEG Equipment Engineer leads development, qualification, and deployment of wafer probers, testers, probe cards, and supporting manufacturing technologies.
Key Responsibilities: Define equipment specifications, drive first-of-a-kind equipment introductions, collaborate with cross-functional teams and suppliers, investigate deviations, perform root cause analyses, and implement corrective actions. Develop experiments, analyze data, and utilize statistical methods to support continuous improvement. Leverage AI-enabled tools and automation to enhance productivity and decision-making. Develop metrics, best-known methods, and process improvements to optimize quality, yield, throughput, and cost.
Qualifications & Skills: Bachelor’s in Mechanical or Electrical Engineering or related field, with 3 years in equipment or manufacturing engineering. Experience in project leadership, problem-solving, statistical analysis, and CAD tools is required. Preferred experience includes semiconductor manufacturing, supplier management, advanced analysis methods, and AI tools application. Interest or experience in developing Agentic AI workflows is a plus.
Key Attributes: Strong technical expertise, collaboration skills, problem-solving ability, and experience supporting high-tech manufacturing processes.
Key Responsibilities: Define equipment specifications, drive first-of-a-kind equipment introductions, collaborate with cross-functional teams and suppliers, investigate deviations, perform root cause analyses, and implement corrective actions. Develop experiments, analyze data, and utilize statistical methods to support continuous improvement. Leverage AI-enabled tools and automation to enhance productivity and decision-making. Develop metrics, best-known methods, and process improvements to optimize quality, yield, throughput, and cost.
Qualifications & Skills: Bachelor’s in Mechanical or Electrical Engineering or related field, with 3 years in equipment or manufacturing engineering. Experience in project leadership, problem-solving, statistical analysis, and CAD tools is required. Preferred experience includes semiconductor manufacturing, supplier management, advanced analysis methods, and AI tools application. Interest or experience in developing Agentic AI workflows is a plus.
Key Attributes: Strong technical expertise, collaboration skills, problem-solving ability, and experience supporting high-tech manufacturing processes.