Manufacturing Process Engineer

Triple Crown is a leading provider of hardware, embedded, software, and mechanical engineering talent. Businesses and technology teams, from Fortune 500 enterprises to emerging startups, rely on our ability to rapidly place the developers, architects, coders, and designers who engineer digital transformation and growth.

Job Type: Contract

Duration: 9-12 Months

Location: Onsite in Goleta, CA

We are seeking a highly motivated Manufacturing / Process Engineer to support the transition of our quantum devices from R&D to scalable production. This role focuses on packaging and wirebonding processes, with responsibility for developing, implementing, and optimizing manufacturing solutions critical to the performance and reliability of our quantum processors. The ideal candidate is a hands-on problem solver with experience in microelectronics manufacturing, process development, and advanced troubleshooting. This position will also drive process transfer to manufacturing, improve supplier quality and lead times, and provide technical input to supplier strategy initiatives.

• Develop, characterize, and document robust and scalable manufacturing processes for the packaging and wirebonding of quantum computing devices.
• - Operate, maintain, and troubleshoot key manufacturing equipment, including but not limited to automated and manual wire bonders, die attach systems, and plasma cleaners within a cleanroom environment.
• - Vendor management (Failure Analysis/RCCA, improve yield and throughput, manage custom workflows, etc.) and monitor and continuously improve the manufacturing performance of key partners
• - Internal production/process improvements (wire bonding, streamline work instructions/procedures, design/build purpose-built fixtures/jigs, optimize inspections)
• - Lead root cause analysis investigations for manufacturing failures and implement effective corrective and preventive actions.
• - Manage the procurement and qualification of new manufacturing equipment and materials. Train and certify production technicians on new processes and equipment.
• - Take ownership of and optimize the inspection criteria document, establishing clear definitions for "present but acceptable" versus "true failure".
• - Evaluate and improve the reliability of device packages, specifically their ability to withstand thermal and mechanical shock events.

Skills:

• Wirebonding
• Microelectronics manufacturing
• Semiconductor packaging
• Process optimization
• Yield improvement
• Root cause analysis
• Failure analysis
• Design of Experiments (DOE)
• Statistical Process Control (SPC)
• Manufacturing process transfer
• Cleanroom manufacturing
• Precision assembly

Benefits:

• Paid weekly!
• Health, Dental and Vision Insurance
• 401k