Senior Packaging Engineer, Silicon Photonics

Senior Packaging Engineer, Silicon Photonics / Optical Systems

Thrively is partnering with a venture-backed deep-tech company developing next-generation optical interconnect and switching technologies for AI and high-performance computing systems is seeking a Senior Packaging Engineer to help design and productize complex photonic assemblies and optical hardware systems.

This is a highly hands-on, detailed engineering role focused on the design, integration, and manufacturability of precision optical packaging systems, particularly fiber-array-to-chip assemblies, photonic modules, and high-density optical interconnects.

The ideal candidate has direct experience designing and shipping optical or photonic hardware products involving:

• fiber arrays
• optical alignment
• photonic packaging
• optical assemblies
• optical transceivers
• waveguide-based systems
• or dense electro-optical modules

This is NOT a traditional semiconductor packaging process role. We are specifically seeking engineers with strong experience in precision optical hardware and photonic package design.

What You’ll Work On

• Design and develop complex photonic and electro-optical packaging systems for advanced optical interconnect products
• Own detailed package design activities including:

*optical/mechanical interfaces

*fiber attach strategies

*adhesive and bonding schemes

*tolerance stack analysis

*thermal/mechanical considerations

*manufacturable assembly approaches

• Develop high-density fiber-array and photonic assembly solutions
• Drive package integration from prototype through manufacturing transfer
• Work cross-functionally across photonics, MEMS, mechanical, electrical, reliability, and manufacturing teams
• Support fixture/tooling concepts, assembly methods, and DFM optimization
• Participate in package design reviews, root-cause investigations, and reliability/performance analysis
• Interface with external vendors, manufacturing partners, and assembly suppliers as needed

Ideal Background

We are especially interested in candidates with experience in one or more of the following:

• Silicon photonics packaging
• Optical transceivers
• Telecom/coherent optics
• Optical switching systems
• Fiber-array packaging
• Planar waveguide or AWG/PLC-based systems
• Aerospace or defense optical systems
• Precision optical assembly and alignment
• MEMS photonics packaging
• High-reliability optical hardware systems

Required Experience

• 7 years of experience in optical, photonic, or optoelectronic packaging engineering
• Demonstrated experience owning detailed package designs that reached production or field deployment
• Hands-on experience with optical alignment, fiber attach, photonic assemblies, or electro-optical integration
• Strong understanding of manufacturable precision assemblies and tolerance-sensitive optical systems
• Experience with materials, adhesives, thermal/mechanical interactions, and reliability considerations in optical hardware
• Experience supporting prototype builds, qualification, and manufacturing ramp activities
• Strong engineering fundamentals and analytical problem-solving capabilities

Preferred Experience

• Experience with high fiber-count optical systems or fiber-array assemblies
• Experience with active/passive optical alignment systems
• Familiarity with Telcordia or other reliability qualification environments
• Experience with MEMS-integrated optical systems
• Experience working in startup or fast-paced product development environments

Additional Notes

We are looking for engineers who enjoy solving real-world hardware problems and bringing sophisticated optical systems from concept into manufacturable products. Candidates with strong detailed engineering instincts, productization experience, and a history of shipping reliable hardware systems will be especially compelling.