MEMS Integration Engineer

MEMS Integration Engineer

Thrively is partnering with a well-funded, early-stage semiconductor startup developing next-generation optical interconnect technology for large-scale computing and AI infrastructure.

The company is building advanced MEMS-enabled silicon photonics switching technology designed to eliminate critical bottlenecks in modern data center architectures. Their chip-scale optical switching platform enables direct optical connectivity between thousands of GPUs and memory resources, dramatically improving performance, power efficiency, and scalability for hyperscale computing environments.

This is a unique opportunity to join a highly technical, mission-driven engineering team building breakthrough hardware at the intersection of MEMS, silicon photonics, and advanced semiconductor manufacturing.

Role Overview

We are seeking a highly technical MEMS Integration Engineer to bridge the gap between internal device design teams and external semiconductor foundry partners.

This role requires a strong background in foundry process engineering combined with system-level process integration expertise. The engineer will own the technical execution of product development, drive new product introduction (NPI), and ensure the successful transfer of complex MEMS and silicon photonics processes into scalable manufacturing environments.

Success in this role will ensure seamless process integration with device specifications while optimizing performance, manufacturability, yield, and cost.

Key Responsibilities

Product Development & Process Transfer

• Partner closely with device design teams and external fabrication partners to define, develop, and refine MEMS fabrication process flows.
• Lead the end-to-end NPI lifecycle, including process transfer to external semiconductor foundries.
• Serve as the primary technical interface between internal design engineers and foundry integration teams.
• Ensure manufacturing processes meet performance, reliability, and scalability requirements.

Foundry Process Integration

• Architect and execute end-to-end MEMS process flows, integrating lithography, etch, thin films, and bonding modules into cohesive fabrication sequences.
• Develop and maintain detailed process specifications and integration documentation.
• Serve as subject matter expert for advanced wafer bonding technologies, including: Fusion bonding, Anodic bonding, Eutectic bonding, Hybrid bonding.
• Lead process development for surface preparation and activation techniques (plasma or chemical).
• Manage thermal expansion mismatch (CTE) and bonding-induced stress in multi-material structures.
• Support development and integration of Through-Silicon Vias (TSVs) for advanced device architectures.
• Coordinate foundry tape-outs and ensure alignment with development schedules and deliverables.
• Monitor Statistical Process Control (SPC) data and rapidly address process excursions.

Yield Engineering & Failure Analysis

• Analyze metrology data (SEM, AFM, C-SAM, IR imaging, profilometry) to identify process defects and integration challenges.
• Investigate failure modes including bond voids, delamination, and process-induced stress.
• Lead Root Cause Analysis (RCA) and structured 8D problem-solving for fabrication issues.
• Collaborate with foundry failure analysis teams to resolve process deviations.
• Develop Continuous Improvement Plans (CIP) to improve yield, device performance, and manufacturing cost.

Required Experience

• BS, MS, or PhD in Electrical Engineering, Mechanical Engineering, MEMS, Applied Physics, Materials Science, or a related field.
• 5 years of experience in semiconductor foundry process engineering, MEMS fabrication, or CMOS process integration.
• Demonstrated experience managing tape-outs and product development through NPI into manufacturing.
• Proven ability to architect and execute complex MEMS process flows involving multiple fabrication modules.
• Deep experience with Wafer-to-Wafer integration and bonding technologies.
• Experience with Through-Silicon Via (TSV) integration and management of thermo-mechanical stress in bonded structures.
• Strong experience with SPC methodologies, yield analysis, and cleanroom process controls.

Preferred Qualifications

• Experience working directly with semiconductor foundries as part of product development or manufacturing transfer.
• Experience with layout tools such as L-Edit, Cadence, or KLayout.
• Knowledge of DFM methodologies, mask floorplanning, and process control monitor (PCM) placement.
• Experience implementing quality frameworks such as Six Sigma, 8D, or FMEA.
• Ability to thrive in a fast-paced startup environment building first-of-kind hardware systems.