Optical Packaging Engineer (Silicon Photonics)

Job Description

We can't predict what the future holds, but we know Texas Instruments will have a part in shaping it.

Kilby Labs is the advanced R&D and product development support organization within TI chartered to define and develop new and innovative technologies and solutions in collaboration with business units and customers. As a member of Kilby Labs you’ll have the chance to interact with many product groups and functions, work with an interdisciplinary team, and bridge from lab to fab to develop technologies to enable new markets.

About The Position

Kilby Labs is seeking a highly motivated and experienced Optical Packaging Engineer to lead the development and implementation of innovative packaging solutions for cutting-edge optical transceiver products including silicon-photonics-based optical sub assemblies, pluggable transceivers, optical engines, and co-packaging of optics. The role requires industry experience with transmit and receive optical sub assembly package design and volume manufacturing, as well as creative problem-solver who can develop unique, breakthrough technologies that leap-frog the state-of-the-art as well as contribute across various aspects of a project depending on program needs.

Responsibilities May Include, But Are Not Limited To

• Own transmit and receive optical sub assembly package designs for datacenter optical interconnect products jointly with partners and ensure they meet customer and partner requirements,
• Define and develop new optical interconnect sub assembly packaging designs and approaches to meet future product and system roadmap needs including for advanced silicon photonics products.
• Develop solutions for low-loss, low-cost and high density scalable fiber attach solutions to silicon photonics and fiber-to-chip packaging solutions.
• Perform multiphysics modelling of optical, thermal, and/or mechanical properties and performance.
• Lead integrity and yield analysis and drive improvement/corrective actions for silicon process and semiconductor assembly packages utilizing appropriate tools.
• Plan and execute process optimization, characterization, design validation, and failure analysis.
• Collaborate with external partners to realize packaging solutions and manage vendor relationships.
• Consider cost effectiveness and perform cost effectiveness studies, develop and introduce package cost reduction programs.
• Maintain product quality, develop and lead package qualification programs.
• Ensure mass production readiness by collaborating with engineering and operations teams.
• Present work and findings to internal and external stakeholders.
• Master’s degree or higher in electrical engineering, mechanical engineering, material science or related field.
• Experience in TOSA/ROSA package development, including design and device/module qualification.
• Experience with manufacturing methods and technologies for attachment of optical fibers to semiconductor chips.
• Understanding in semiconductor packaging technology, including die attach, wire bonding, flip-chip, and micro-optics.
• Knowledge of industry optical packaging competitive landscape, trends, industry standards, supply chain, manufacturing equipment and reliability requirements.
• Demonstrated analytical and problem-solving skills.
• Experience with fiber handling, fiber cleaving, wet processing, fiber connectors.
• Experience with Optical and electro-optical characterization and probing.
• Experience with automated test setups for wafer/ die scale electro-optical measurements through Python or any other language and motion controllers.
• Experience designing and developing Heterogenous Integration (HI) assembly processes for photonic and electronic integration.
• Understanding of the end applications related optical networking, including pluggable modules and co-packaged optics.
• Strong verbal and written communication skills.
• Ability to work in teams and collaborate effectively with people in different functions.
• Ideal candidate must also excel at promoting new ideas, building collaborative relationships, working across organizations.
  
  

Qualifications

Minimum Requirements:

• Master’s degree or higher in electrical engineering, mechanical engineering, material science or related field.
• Experience in TOSA/ROSA package development, including design and device/module qualification.
• Experience with manufacturing methods and technologies for attachment of optical fibers to semiconductor chips.
• Understanding in semiconductor packaging technology, including die attach, wire bonding, flip-chip, and micro-optics.
• Knowledge of industry optical packaging competitive landscape, trends, industry standards, supply chain, manufacturing equipment and reliability requirements.
• Demonstrated analytical and problem-solving skills.
  
  

Preferred Requirements

• Experience with fiber handling, fiber cleaving, wet processing, fiber connectors.
• Experience with Optical and electro-optical characterization and probing.
• Experience with automated test setups for wafer/ die scale electro-optical measurements through Python or any other language and motion controllers.
• Experience designing and developing Heterogenous Integration (HI) assembly processes for photonic and electronic integration.
• Understanding of the end applications related optical networking, including pluggable modules and co-packaged optics.
• Strong verbal and written communication skills.
• Ability to work in teams and collaborate effectively with people in different functions.
• Ideal candidate must also excel at promoting new ideas, building collaborative relationships, working across organizations.
  
  

About Us

Why TI?

• Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
• We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
• Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.
  
  

About Texas Instruments

Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com .

Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, disability, genetic information, national origin, gender, gender identity and expression, age, sexual orientation, marital status, veteran status, or any other characteristic protected by federal, state, or local laws.

If you are interested in this position, please apply to this requisition.

About The Team

TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.