Demo

IC Packaging Design Engineer

Tessolve
Chandler, AZ Contractor
POSTED ON 7/29/2026
AVAILABLE BEFORE 8/27/2026

Hi Everyone,

Hope you are doing well..

One of our valued customer is looking for IC Packaging Design Engineer at Chandler, AZ / Hillsboro, Oregon


Here is the JD for your reference :


IC Packaging Design Engineer

LOC: Chandler, AZ or Hillsboro, OR (ONSITE)

Longterm Contract – 1 Year


Skills Required:

Bachelor’s or Master’s degree in Electrical /Electronics Engineering

Experience Tier: Senior-level (primary); Mid-level (secondary)

•Senior-Level: ~10 years in IC packaging / package design

•Mid-Level: 4–6 years (MS) or 6 years (BS) in IC packaging / package design

Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)

Experience:

Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Package Designer (APD / SiP)


Candidates should have experience in the below domains:

  • Physical Design & Layout
  • Substrate design and layout
  • SI/PI aware design implementation
  • Design for performance, manufacturability, yield, and reliability
  • Design rule compliance


share resume: amritanshuman.swain@tessolve.com


About us:

Tessolve Semiconductors, a venture of Hero Electronix, is a Design and Test Engineering Service Company providing End to End Solutions from Product Engineering, Software, Hardware, Wireless, Automotive and Embedded Solutions. Tessolve offers a unique combination of pre-silicon and post-silicon expertise to provide an efficient turnkey solution for silicon bring-up, spec to the product. With 2500 employees worldwide, Tessolve provides a one-stop-shop solution with full-fledged hardware and software capabilities, including its advanced silicon and system testing labs. Tessolve offers a Turnkey ASIC Solution, from design to packaged parts. We have a global presence with office locations in the United States, India, Singapore, Malaysia, Germany, United Kingdom, China, UK, Japan, Thailand, Philippines, and Test Labs in India, Singapore, Malaysia, Austin, San Jose. Tessolve offers a highly competitive compensation and benefits along with an electric work environment to scale one’s intellect, skills and growth.

Hourly Wage Estimation for IC Packaging Design Engineer in Chandler, AZ
$41.00 to $48.00
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