IC Package Integration Engineer

What To Expect
Our team is seeking a highly motivated IC Package Integration Engineer to lead IC package manufacturing integration, yield, quality, and supply continuity for next-generation AI compute platforms. This role sits at the intersection of package design, manufacturing process development, and supply chain integration, ensuring advanced semiconductor packages transition smoothly from engineering builds into high-volume production.

In this highly visible role, the engineer will collaborate closely with EE, SI/PI, thermal/mechanical, reliability, and package design teams to review package architectures, identify manufacturability risks early, and ensure robust design-for-manufacturing implementation. This role does not own end-to-end IC package design. However, strong hands-on experience in package and substrate design is critical to effectively assess design decisions, identify potential design limitations, and ensure designs are optimized for high-volume manufacturing. The ideal candidate can bridge design intent with manufacturing reality and proactively flag issues before they impact yield, reliability, or scalability.

The engineer will interface with material suppliers, substrate vendors, foundry partners, and OSAT assembly/test vendors, driving process capability, yield improvement, and scalable manufacturing.

What You'll Do

Lead SoC package integration and high-volume manufacturing readiness, including ownership of OSAT/Foundry manufacturing processes

Partner with OSAT/Foundry vendors to bring advanced packaging solutions from concept through qualification into high-volume manufacturing, with ownership of process capability, yield, quality, and ramp execution

Drive package-level yield improvement, failure analysis, and reliability investigations, resolving issues across OSAT, substrate, and material suppliers

Interface with substrate manufacturers and laminate suppliers to ensure stack-up integrity, manufacturability, and yield stability

Review IC package and substrate designs using EDA tools (e.g., Cadence Allegro Package Designer or equivalent), identifying design-for-manufacturability risks and ensuring seamless transition into production

Evaluate and provide feedback on substrate stack-ups, via architectures (including DCTV, TTV), routing density, and power delivery structures, ensuring alignment between design and manufacturing constraints

Collaborate with design teams to define and enforce design-for-manufacturing (DFM) guidelines across package architecture and substrate layout

What You'll Bring

Master’s Degree in Engineering, or related field, or equivalent experience

7 years of experience in semiconductor packaging (2D/2.5D/3D etc.) spanning manufacturing integration and exposure to package or substrate design

Hands-on experience with IC package or substrate design concepts, including substrate layout and routing fundamentals, via architecture and stack-up considerations, familiarity with test vehicle structures such as DCTV, TTV, or similar and experience with EDA tools such as: Cadence Allegro Package Designer or related

Strong understanding of advanced packaging technologies, including flip-chip BGA, high-density substrates, multi-die integration, and high-power packages

Hands-on experience with OSAT assembly processes (die attach, underfill, lid attach, ball attach, warpage control)

Understanding of substrate materials and laminate systems, including CCL, glass fiber, and copper foil interactions

Experience driving high-volume manufacturing ramp, yield improvement, and failure analysis

Strong problem-solving skills with a data-driven approach

Benefits
Compensation and Benefits
Along with competitive pay, as a full-time Tesla employee, you are eligible for the following benefits at day 1 of hire:

Medical plans > plan options with $0 payroll deduction

Family-building, fertility, adoption and surrogacy benefits

Dental (including orthodontic coverage) and vision plans, both have options with a $0 paycheck contribution

Company Paid (Health Savings Accounts) HSA Contribution when enrolled in the High-Deductible medical plan with HSA

Healthcare and Dependent Care Flexible Spending Accounts (FSA)

401(k) with employer match, Employee Stock Purchase Plans, and other financial benefits

Company paid Basic Life, AD&D

Short-term and long-term disability insurance (90 day waiting period)

Employee Assistance Program

Sick and Vacation time (Flex time for salary positions, Accrued hours for Hourly positions), and Paid Holidays

Back-up childcare and parenting support resources

Voluntary benefits to include: critical illness, hospital indemnity, accident insurance, theft & legal services, and pet insurance

Weight Loss and Tobacco Cessation Programs

Tesla Babies program

Commuter benefits

Employee discounts and perks program

Expected Compensation

$160,000 - $270,000/annual salary cash and stock awards benefits

Pay offered may vary depending on multiple individualized factors, including market location, job-related knowledge, skills, and experience. The total compensation package for this position may also include other elements dependent on the position offered. Details of participation in these benefit plans will be provided if an employee receives an offer of employment.

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