What are the responsibilities and job description for the Chip Test Engineer position at Teradar?
We are looking for a Chip Test Engineer with deep expertise in RF, digital, and analog/mixed-signal testing to lead the development of test solutions from initial silicon bring-up through high-volume production.
This role is critical in bridging R&D and manufacturing, taking early proof-of-concept validation
setups and scaling them into robust wafer-level and ATE production-test solutions for our advanced sensor ICs used in ADAS and autonomous-driving applications.
What You’ll Do
o Lead initial silicon bring-up and bench validation for new ICs, including debugging and characterization of first silicon.
o Develop proof-of-concept (PoC) test setups using lab equipment and translate these into scalable production test methodologies.
o Design and implement production test solutions at:
- Wafer level (probe)
- ATE platforms (e.g., Teradyne, Advantest)
o Own the full lifecycle of test development: bench → characterization → correlation → production release.
o Develop and optimize test programs, scripts, and automation using C , Python, or similar tools.
o Work closely with design (RF, analog, digital), systems, and product engineering teams to define test coverage and ensure alignment with specifications.
o Perform correlation between bench measurements and ATE results, ensuring accuracy and repeatability.
o Characterize and validate the performance of:
- RF circuits
- ADCs
- DSP blocks
- Mixed-signal subsystems
o Support testing of multi-chip module (MCM) packages, including system-level validation considerations.
o Analyze test data to identify yield issues, parametric shifts, and failure modes using tools like JMP, Spotfire, or similar.
o Drive test time reduction, yield improvement, and cost optimization in production.
o Collaborate with OSATs and test vendors to deploy and qualify test solutions in manufacturing.
What You Bring
o Education: Degree in Electrical Engineering, Computer Engineering, or related field.
o 5 years of experience in semiconductor test engineering, with strong product engineering exposure.
Proven experience across:
o Bench testing and silicon bring-up
o Test development and characterization
o Production test implementation (wafer probe ATE)
Strong hands-on experience with:
o RF test methods (e.g., spectrum analysis, signal generation)
o Analog and mixed-signal validation
o High-speed digital testing
o Familiarity with testing:
- RF circuits
- ADCs
- DSP-based systems
o Experience working with multi-chip module (MCM) packages is highly desirable.
o Proficiency in ATE platforms such as Teradyne or Advantest.
o Strong programming skills in Python, C , or similar for automation and data analysis.
o Hands-on experience with lab equipment such as:
- Oscilloscopes
- Spectrum analyzers
- Signal generators
- Network analyzers
o Strong understanding of correlation between lab and production environments.
o Excellent debugging, analytical, and problem-solving skills.
Bonus Points
o Experience with mmWave or RFIC-based systems.
o Background in automotive semiconductor products (ADAS/AV).
o Experience working closely with OSATs for test transfer and yield ramp.
o Prior experience in a startup or fast-paced product development environment.
Salary : $140,000 - $180,000