Sr. Principal ASIC/Analog Design Engineer

We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.

Job Description

The Integrated Circuit Design group at Teledyne FLIR develops the image sensors for use in a wide range of applications. Infrared image sensors designed here are used in high volume cell phone and automotive cameras to high-end performance systems for security and search and track applications. This wide range of applications and the demands for image performance leads to an ever changing and demanding set of design specifications that will keep you challenged and always looking for new and better ways to implement circuits. As Teledyne FLIR is vertically integrated, our group is involved in early system trades as well as support for camera integration and production.

You will be tasked take the lead in the design and analysis of the entire chip. This includes designing the circuitry of the signal path (detector interface, amplifiers, sampling, ADCs) and support circuitry (such as biases and PLLs) from transistor level simulations to system level analysis. This also means working with digital and layout engineers to ensure the entire chip works as intended the first time.

Our design teams of 3 to 5 engineers on an image sensor are small, so each engineer is responsible for the design trades and implementation of a large portion of the overall chip. While completing system level trades as well as working on the individual blocks of a design is challenging, it also results in a great sense of accomplishment when the image sensors are completed and integrated into cameras. Ultimately seeing your work used by people around the world to save lives and livelihoods in a wide range of applications allows you to see a clear purpose and take pride in your everyday work.

Your job in plain text

• Determine image sensor requirements based on high level customer requests
• Perform chip level trade analysis to determine best architectural approach
• Lead team in analysis techniques to confirm architectural approach meets customer needs
• Design and analyze block level circuitry to support architectural approach and validate sensor requirements
• Coordinate with other design engineers on the team to ensure proper interfaces and implementation
• Document and present your work to both peers and customers to instill confidence in the design
• Collaborate with other designers and system engineers to ensure successful products

To be ready to take on this role we would love if you have

• Applicants must be a U.S. Citizen or Perm Resident
• Significant experience (10 years) in CMOS Integrated Circuit design
• Highly skilled in ROIC (Readout Integrated Circuit) designs, trades and analysis techniques
• Experience with infrared image sensor design and associated detectors
• Architectural level CMOS analysis including noise and power
• Leadership skills in communication and collaboration in small technical teams

What Teledyne FLIR offers you

• Opportunity to develop your career with the world's leading company in thermal and sensing technology
• At Teledyne FLIR, you get a unique opportunity to experience how cutting-edge R&D, and vertical development come together under one roof. We do our research, our development, and our manufacturing
• Work in a collaborative environment with other highly skilled and motivated engineers
• Take on new challenges with every design
• Opportunity to have your work integrated into recognizable products used throughout the world
• Ability to live along California’s beautiful Central Coast

Interested?

If you liked what you just read, and believe you are the person that will make us better, do not hesitate to apply.

Salary Range:

$141,900.00-$189,200.000