What are the responsibilities and job description for the Packaging Consultant position at Technical Link?
Job Details
Santa Clara, CA
6-12 months ongoing (in a perfect world would want a FT conversion)
She wants to see people that can fully work onsite
Any Visa
CADENCE ADP is the most important thing, a small write up would go a long way with this manager.
2 interviews, first one with team lead, second one with manager and director (will be a Microsoft Teams video call)
Requirements
Bachelor s degree in Computer Science, Electrical Engineering or related fields and 10-15 years of related professional experience.
Master s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 5-10 years of experience.
Job Responsibilities
- Experience with 2.5D package design and development like CoWoS
- Strong expertise in using IC package layout tools like Cadence APD
- Understanding IC package design requirements for high speed interfaces and setup constraints manager
- Interface with the IC physical design teams for optimizing the die floor plan
- Experience in interfacing with Substrate suppliers and OSATs
- Ability to do automation of the layout tasks using scripting
- Power plane design and translating power supply requirements into design
- Familiarity with IC packaging technologies, materials, substrate design rules and assembly rules
- Track record of new product introduction from concept through development and production is a plus
- Knowledge of the thermal and mechanical analysis of the IC package development is a plus
- A team player with strong communication, presentation, and documentation skills
Salary : $60 - $90